Inventor
PAVELKA JOHN B
US10 patents
⚠️ This page may combine multiple inventors who share the name “PAVELKA JOHN B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS5870823AFeb 16, 1999
Method of forming a multilayer electronic packaging substrate with integral cooling channels
IBM229 citations99
US5239443AAug 24, 1993
Blind hole cold plate cooling system
IBM138 citations97
US6274214B1Aug 14, 2001
Microelectronic package module with temporary lid
IBM19 citations91
US6054008AApr 25, 2000
Process for adhesively attaching a temporary lid to a microelectronic package
IBM23 citations91
USD407382SMar 30, 1999
Lid for a microelectronic package
IBM11 citations67
SILICON LAB INC
5 patentsUS6323735B1Nov 27, 2001
Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
SILICON LAB INC149 citations97
US7209011B2Apr 24, 2007
Method and apparatus for synthesizing high-frequency signals for wireless communications
SILICON LAB INC16 citations91
US7990132B2Aug 2, 2011
Current sensor including an integrated circuit die including a first and second coil
SILICON LAB INC17 citations84
US6903617B2Jun 7, 2005
Method and apparatus for synthesizing high-frequency signals for wireless communications
SILICON LAB INC10 citations72
US9355870B1May 31, 2016
Integrated circuit with sensor area and resin dam
SILICON LAB INC2 citations62