USD407382SExpiredUtility

Lid for a microelectronic package

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Assignee: IBMPriority: Oct 24, 1996Filed: Oct 24, 1996Granted: Mar 30, 1999
Est. expiryOct 24, 2016(expired)· nominal 20-yr term from priority
Inventors:John V. AcciaioliMyra Muth BoenkeLarry D. GrossMartin Jay MarottiJohn B. PavelkaRoland Zapfe
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PatentIndex Score
11
Cited by
5
References
1
Claims

Claims

exact text as granted — not AI-modified
We claim the ornamental design for a lid for a microelectronic package, as shown and described.

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