Inventor · disambiguated record
John B. Pavelka
Also filed as: PAVELKA JOHN · PAVELKA JOHN B · PAVELKA JOHN BLAKE
19 granted patents·2 pending applications·782 citations·filing 1992–2022
96Inventor score
Files withSILICON LAB INC9IBM7CIRRUS LOGIC INT SEMICONDUCTOR LTD3BLACK SAND TECHNOLOGIES INC1SPEER RAYMOND1
Top patents by PatentIndex Score
21 records- 0197US6323735B1Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductorsSILICON LAB INC·Filed 2000·Granted Nov 27, 2001·149 cites·33 claims
- 0296US5870823AMethod of forming a multilayer electronic packaging substrate with integral cooling channelsIBM·Filed 1996·Granted Feb 16, 1999·229 cites·18 claims
- 0394US8852513B1Systems and methods for packaging integrated circuit gas sensor systemsSPEER RAYMOND·Filed 2011·Granted Oct 7, 2014·56 cites·21 claims
- 0491US7679162B2Integrated current sensor packageSILICON LAB INC·Filed 2005·Granted Mar 16, 2010·24 cites·17 claims
- 0591US5239443ABlind hole cold plate cooling systemIBM·Filed 1992·Granted Aug 24, 1993·138 cites·18 claims
- 0688US7990132B2Current sensor including an integrated circuit die including a first and second coilSILICON LAB INC·Filed 2008·Granted Aug 2, 2011·17 cites·10 claims
- 0787US7209011B2Method and apparatus for synthesizing high-frequency signals for wireless communicationsSILICON LAB INC·Filed 2005·Granted Apr 24, 2007·16 cites·25 claims
- 0886US7362086B2Integrated current sensorSILICON LAB INC·Filed 2005·Granted Apr 22, 2008·14 cites·19 claims
- 0983US9355870B1Integrated circuit with sensor area and resin damSILICON LAB INC·Filed 2015·Granted May 31, 2016·2 cites·23 claims
- 1083US7224232B2RF power amplifier and method for packaging the sameSILICON LAB INC·Filed 2004·Granted May 29, 2007·17 cites·20 claims
- 1170US5764529AMethod and apparatus for automatic frequency and voltage selection for microprocessorsIBM·Filed 1996·Granted Jun 9, 1998·41 cites·8 claims
- 1267US6054008AProcess for adhesively attaching a temporary lid to a microelectronic packageIBM·Filed 1998·Granted Apr 25, 2000·23 cites·7 claims
- 1366US11887924B2Chip scale packageCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2022·Granted Jan 30, 2024·0 cites·11 claims
- 1463US7935990B2RF power amplifier and method for packaging the sameBLACK SAND TECHNOLOGIES INC·Filed 2006·Granted May 3, 2011·2 cites·21 claims
- 1563US6274214B1Microelectronic package module with temporary lidIBM·Filed 1999·Granted Aug 14, 2001·19 cites·13 claims
- 1662US11562952B2Chip scale packageCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2021·Granted Jan 24, 2023·0 cites·22 claims
- 1761US6903617B2Method and apparatus for synthesizing high-frequency signals for wireless communicationsSILICON LAB INC·Filed 2002·Granted Jun 7, 2005·10 cites·18 claims
- 1858USD407382SLid for a microelectronic packageIBM·Filed 1996·Granted Mar 30, 1999·11 cites·1 claims
- 1949US5745238AApparatus and method for non-destructive inspection and/or measurementIBM·Filed 1992·Granted Apr 28, 1998·14 cites·74 claims
- 2047US2021111131A1Conformal shield for blocking light in an integrated circuit packageCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2020·Application pending·0 cites
- 2133US2002041216A1Method and apparatus for synthesizing dual band high-frequency signals for wireless communicationsSILICON LAB INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →