Inventor

LIU KUAN-LIANG

TW47 patents

⚠️ This page may combine multiple inventors who share the name “LIU KUAN-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU KUAN-LIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Bond chuck, methods of bonding, and tool including bond chuck

Method for forming a semiconductor-on-insulator (SOI) substrate

Bond chuck, methods of bonding, and tool including bond chuck

Semiconductor-on-insulator wafer having a composite insulator layer

Method for forming hybrid-bonding structure

Method for forming a semiconductor-on-insulator (SOI) substrate

Apparatus for bond wave propagation control

Seal ring structures and methods of forming same

Apparatus for bond wave propagation control

Semiconductor structure and manufacturing method thereof

Semiconductor wafer with devices having different top layer thicknesses

Embedded backside memory on a field effect transistor

Method for forming a semiconductor-on-insulator (SOI) substrate

Embedded backside memory on a field effect transistor

Method for forming a semiconductor-on-insulator (SOI) substrate

Multi-function substrate

Semiconductor-on-insulator wafer having a composite insulator layer

Multi-function substrate

Seal ring structures and methods of forming same

Apparatus for bond wave propagation control

Multi-function substrate

Seal ring structures and methods of forming same

Semiconductor-on-insulator wafer having a composite insulator layer

Seal ring structures and methods of forming same

Semiconductor wafer with devices having different top layer thicknesses

Semiconductor wafer with devices having different top layer thicknesses

Semiconductor structure and manufacturing method thereof

Method of forming semiconductor-on-insulator (SOI) substrate

Metal line design for hybrid-bonding application

Method of manufacturing semiconductor structure

Method for removing edge of substrate in semiconductor structure

Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate

UNITED MICROELECTRONICS CORP

Transistor structure

High-voltage metal-oxide-semiconductor transistor and fabrication method thereof

Semiconductor device and method for forming the same

High-voltage metal-oxide-semiconductor transistor and fabrication method thereof

Transistor structure

Transistor structure

Transistor structure

High voltage semiconductor device and manufacturing method thereof

Method for preventing dishing during the manufacture of semiconductor devices

Transistor structure

High voltage semiconductor device and manufacturing method thereof

Method of fabricating a transistor with reduced hot carrier injection effects

Method for preventing dishing during the manufacture of semiconductor devices

Isolation structure and method for fabricating the same

BAI MINGSIAN R

Acoustic camera