Inventor

HUANG KUEI-WEI

TW67 patents

⚠️ This page may combine multiple inventors who share the name “HUANG KUEI-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG KUEI-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Package-on-package structure including a thermal isolation material and method of forming the same

Alignment in the packaging of integrated circuits

Semiconductor packaging structure and method

Process for forming package-on-package structures

Semiconductor package and method

Package-on-package structures and methods for forming the same

Package on package bonding structure and method for forming the same

Semiconductor bonding structures and methods

Semiconductor bonding structures and methods

Semiconductor packaging structure and method

Package-on-package structures and methods for forming the same

Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates

Package on-package structures and methods for forming the same

Bonding through multi-shot laser reflow

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

Bonding through multi-shot laser reflow

Semiconductor package and method

Package-on-package structure including a thermal isolation material

Bonding through multi-shot laser reflow

System for processing semiconductor devices

Methods of forming semiconductor packages

Bonding through multi-shot laser reflow

Bump-on-trace packaging structure and method for forming the same

Package on-package structure including a thermal isolation material and method of forming the same

Package on-package structure with epoxy flux residue

Semiconductor bonding structures and methods

TAIWAN SEMICONDUCTOR MFG

Thermal compress bonding

Package on package bonding structure and method for forming the same

Alignment in the packaging of integrated circuits

Packaging methods and packaged semiconductor devices

Process for forming package-on-package structures

Package on package bonding structure and method for forming the same

Packaging methods and structures for semiconductor devices

Process for forming package-on-package structures

Thermal compress bonding

Forming low stress joints using thermal compress bonding

CHEN MENG-TSE

Process for forming packages

Methods for forming 3DIC package

Warpage control in a package-on-package structure

Contact and method of formation

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

Process for forming package-on-package structures

LIN CHUN-CHENG

Semiconductor packaging structure and method

LIN CHENG-CHUNG

Fine-pitch package-on-package structures and methods for forming the same

CHEN MENG TSE

Bump-on-trace packaging structure and method for forming the same

CHENG MING-DA

Semiconductor package

HUANG KUEI WEI

Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates

CHUNGHWA PICTURE TUBES LTD

Touch display panel

TSAI YI-CHENG

Liquid crystal display device

HUANG KUEI-WEI

Driving method and driving apparatus for displaying apparatus