Inventor
WANG ZHONGZE
US130 patents
⚠️ This page may combine multiple inventors who share the name “WANG ZHONGZE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
38 patentsUS6503805B2Jan 7, 2003
Channel implant through gate polysilicon
MICRON TECHNOLOGY INC125 citations99
US6808994B1Oct 26, 2004
Transistor structures and processes for forming same
MICRON TECHNOLOGY INC142 citations98
US6812103B2Nov 2, 2004
Methods of fabricating a dielectric plug in MOSFETS to suppress short-channel effects
MICRON TECHNOLOGY INC68 citations96
US6716687B2Apr 6, 2004
FET having epitaxial silicon growth
MICRON TECHNOLOGY INC58 citations96
US6599789B1Jul 29, 2003
Method of forming a field effect transistor
MICRON TECHNOLOGY INC67 citations96
US6277674B1Aug 21, 2001
Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same
MICRON TECHNOLOGY INC39 citations96
US6093661AJul 25, 2000
Integrated circuitry and semiconductor processing method of forming field effect transistors
MICRON TECHNOLOGY INC74 citations96
US7314812B2Jan 1, 2008
Method for reducing the effective thickness of gate oxides by nitrogen implantation and anneal
MICRON TECHNOLOGY INC12 citations93
US6984570B2Jan 10, 2006
Wafer bonding method of forming silicon-on-insulator comprising integrated circuitry
MICRON TECHNOLOGY INC12 citations93
US6977419B2Dec 20, 2005
MOSFETs including a dielectric plug to suppress short-channel effects
MICRON TECHNOLOGY INC14 citations93
US6949479B2Sep 27, 2005
Methods of forming transistor devices
MICRON TECHNOLOGY INC21 citations93
US6864155B2Mar 8, 2005
Methods of forming silicon-on-insulator comprising integrated circuitry, and wafer bonding methods of forming silicon-on-insulator comprising integrated circuitry
MICRON TECHNOLOGY INC28 citations93
US6812529B2Nov 2, 2004
Suppression of cross diffusion and gate depletion
MICRON TECHNOLOGY INC19 citations93
US6583518B2Jun 24, 2003
Cross-diffusion resistant dual-polycide semiconductor structure and method
MICRON TECHNOLOGY INC18 citations93
US6555455B1Apr 29, 2003
Methods of passivating an oxide surface subjected to a conductive material anneal
MICRON TECHNOLOGY INC25 citations93
US6744102B2Jun 1, 2004
MOS transistors with nitrogen in the gate oxide of the p-channel transistor
MICRON TECHNOLOGY INC14 citations92
US6541395B1Apr 1, 2003
Semiconductor processing method of forming field effect transistors
MICRON TECHNOLOGY INC31 citations92
US6417546B2Jul 9, 2002
P-type FET in a CMOS with nitrogen atoms in the gate dielectric
MICRON TECHNOLOGY INC21 citations92
US6723597B2Apr 20, 2004
Method of using high-k dielectric materials to reduce soft errors in SRAM memory cells, and a device comprising same
MICRON TECHNOLOGY INC24 citations91
US6767778B2Jul 27, 2004
Low dose super deep source/drain implant
MICRON TECHNOLOGY INC17 citations88
US7154146B2Dec 26, 2006
Dielectric plug in mosfets to suppress short-channel effects
MICRON TECHNOLOGY INC12 citations84
US6730553B2May 4, 2004
Methods for making semiconductor structures having high-speed areas and high-density areas
MICRON TECHNOLOGY INC13 citations84
US7968954B2Jun 28, 2011
Intermediate semiconductor device having nitrogen concentration profile
MICRON TECHNOLOGY INC5 citations74
US7259435B2Aug 21, 2007
Intermediate semiconductor device having nitrogen concentration profile
MICRON TECHNOLOGY INC8 citations74
US7169662B2Jan 30, 2007
Methods for making semiconductor structures having high-speed areas and high-density areas
MICRON TECHNOLOGY INC5 citations74
US7153731B2Dec 26, 2006
Method of forming a field effect transistor with halo implant regions
MICRON TECHNOLOGY INC6 citations74
US7119369B2Oct 10, 2006
FET having epitaxial silicon growth
MICRON TECHNOLOGY INC8 citations74
US7112482B2Sep 26, 2006
Method of forming a field effect transistor
MICRON TECHNOLOGY INC5 citations74
US7109105B2Sep 19, 2006
Methods of making semiconductor fuses
MICRON TECHNOLOGY INC3 citations74
US6987291B2Jan 17, 2006
Integrated transistor circuitry
MICRON TECHNOLOGY INC9 citations74
US6974757B2Dec 13, 2005
Method of forming silicon-on-insulator comprising integrated circuitry
MICRON TECHNOLOGY INC5 citations74
US6927473B2Aug 9, 2005
Semiconductor fuses and semiconductor devices containing the same
MICRON TECHNOLOGY INC4 citations74
US6903420B2Jun 7, 2005
Silicon-on-insulator comprising integrated circuitry
MICRON TECHNOLOGY INC10 citations74
US6867131B2Mar 15, 2005
Apparatus and method of increasing sram cell capacitance with metal fill
MICRON TECHNOLOGY INC9 citations74
US6784062B2Aug 31, 2004
Transistor formation for semiconductor devices
MICRON TECHNOLOGY INC8 citations74
US6774022B2Aug 10, 2004
Method of passivating an oxide surface subjected to a conductive material anneal
MICRON TECHNOLOGY INC9 citations74
US6770921B2Aug 3, 2004
Sidewall strap for complementary semiconductor structures and method of making same
MICRON TECHNOLOGY INC5 citations74
US6703263B2Mar 9, 2004
Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same
MICRON TECHNOLOGY INC5 citations74
QUALCOMM INC
10 patentsUS9786356B2Oct 10, 2017
Memory device with adaptive voltage scaling based on error information
QUALCOMM INC12 citations84
US9691868B2Jun 27, 2017
Merging lithography processes for gate patterning
QUALCOMM INC9 citations84
US9576801B2Feb 21, 2017
High dielectric constant/metal gate (HK/MG) compatible floating gate (FG)/ferroelectric dipole non-volatile memory
QUALCOMM INC17 citations84
US9536596B2Jan 3, 2017
Three-port bit cell having increased width
QUALCOMM INC8 citations84
US9524972B2Dec 20, 2016
Metal layers for a three-port bit cell
QUALCOMM INC10 citations84
US9336863B2May 10, 2016
Dual write wordline memory cell
QUALCOMM INC11 citations84
US9111635B2Aug 18, 2015
Static random access memories (SRAM) with read-preferred cell structures, write drivers, related systems, and methods
QUALCOMM INC8 citations84
US9379058B2Jun 28, 2016
Grounding dummy gate in scaled layout design
QUALCOMM INC13 citations83
US7872930B2Jan 18, 2011
Testing a memory device having field effect transistors subject to threshold voltage shifts caused by bias temperature instability
QUALCOMM INC9 citations80
US11562205B2Jan 24, 2023
Parallel processing of a convolutional layer of a neural network with compute-in-memory array
QUALCOMM INC5 citations75
WANG ZHONGZE
1 patentJUNG SEONG-OOK
1 patentShowing the top 50 of 130 patents by PatentIndex Score.