Inventor
IWAKI TAKAYUKI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “IWAKI TAKAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
4 patentsUS10607998B1Mar 31, 2020
Integrated circuitry, DRAM circuitry, method of forming a plurality of conductive vias, and method of forming DRAM circuitry
MICRON TECHNOLOGY INC3 citations73
US10847651B2Nov 24, 2020
Semiconductor devices including electrically conductive contacts and related systems and methods
MICRON TECHNOLOGY INC3 citations72
US11152371B2Oct 19, 2021
Apparatus comprising monocrystalline semiconductor materials and monocrystalline metal silicide materials, and related methods, electronic devices, and electronic systems
MICRON TECHNOLOGY INC1 citations62
US10840249B2Nov 17, 2020
Integrated circuitry constructions
MICRON TECHNOLOGY INC1 citations62
NEC ELECTRONICS CORP
3 patentsUS7294534B2Nov 13, 2007
Interconnect layout method
NEC ELECTRONICS CORP194 citations98
US7691758B2Apr 6, 2010
Method of forming insulating film and method of manufacturing semiconductor device
NEC ELECTRONICS CORP4 citations62
US7642155B2Jan 5, 2010
Semiconductor device with metal nitride barrier layer between gate dielectric and silicided, metallic gate electrodes
NEC ELECTRONICS CORP1 citations51
KOITO MFG CO LTD
3 patentsRENESAS ELECTRONICS CORP
2 patentsUS7956461B2Jun 7, 2011
Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer
RENESAS ELECTRONICS CORP2 citations62
US8368176B2Feb 5, 2013
Semiconductor device and method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations60