Inventor
KIM KYUNG MOON
KR18 patents
⚠️ This page may combine multiple inventors who share the name “KIM KYUNG MOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPPAC INC
4 patentsUS6940178B2Sep 6, 2005
Self-coplanarity bumping shape for flip chip
CHIPPAC INC51 citations95
US6737295B2May 18, 2004
Chip scale package with flip chip interconnect
CHIPPAC INC34 citations89
US7407877B2Aug 5, 2008
Self-coplanarity bumping shape for flip-chip
CHIPPAC INC7 citations73
US7211901B2May 1, 2007
Self-coplanarity bumping shape for flip chip
CHIPPAC INC2 citations62
STATS CHIPPAC PTE LTD
3 patentsUS9748157B1Aug 29, 2017
Integrated circuit packaging system with joint assembly and method of manufacture thereof
STATS CHIPPAC PTE LTD10 citations84
US9865554B2Jan 9, 2018
Integrated circuit packaging system with under bump metallization and method of manufacture thereof
STATS CHIPPAC PTE LTD3 citations72
US10109587B1Oct 23, 2018
Integrated circuit packaging system with substrate and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations49
SAMSUNG ELECTRONICS CO LTD
2 patentsAHMAD NAZIR
2 patentsUS8119450B2Feb 21, 2012
Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots
AHMAD NAZIR2 citations58
US9312150B2Apr 12, 2016
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
AHMAD NAZIR0 citations48