P

Inventor

SASAKI TAKAFUMI

JP69 patents
⚠️ This page may combine multiple inventors who share the name “SASAKI TAKAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

15 patents
USD916037SApr 13, 2021

Cover of seal cap for reaction chamber for semiconductor

KOKUSAI ELECTRIC CORP9 citations86
USD939459SDec 28, 2021

Boat for wafer processing apparatus

KOKUSAI ELECTRIC CORP15 citations85
US10424520B1Sep 24, 2019

Method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP15 citations85
US10453735B2Oct 22, 2019

Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording medium

KOKUSAI ELECTRIC CORP8 citations84
US11453942B2Sep 27, 2022

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP1 citations73
US10961625B2Mar 30, 2021

Substrate processing apparatus, reaction tube and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP2 citations73
US10808318B2Oct 20, 2020

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP3 citations73
US11685992B2Jun 27, 2023

Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP2 citations72
US12203167B2Jan 21, 2025

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations62
US11898247B2Feb 13, 2024

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations62
US11859280B2Jan 2, 2024

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations62
US10978361B2Apr 13, 2021

Substrate processing apparatus and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US12540388B2Feb 3, 2026

Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US12053805B2Aug 6, 2024

Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US12546002B2Feb 10, 2026

Reaction tube, substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations59

HITACHI INT ELECTRIC INC

8 patents

SASAKI TAKAFUMI

5 patents

FANUC LTD

4 patents

RICOH CO LTD

4 patents

OTSUKI TOSHIAKI

3 patents

FANUC CORP

2 patents

TOKYO SHIBAURA ELECTRIC CO

2 patents

SAIDO SHUHEI

1 patent

YAMANAKA KUNIHIRO

1 patent

HARA DAISUKE

1 patent

KURIBAYASHI KOEI

1 patent

YUASA KAZUHIRO

1 patent

MITSUI MINING & SMELTING CO LTD

1 patent

PARK SOYOUNG

1 patent

Showing the top 50 of 69 patents by PatentIndex Score.