Inventor
SASAKI TAKAFUMI
JP69 patents
⚠️ This page may combine multiple inventors who share the name “SASAKI TAKAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
15 patentsUSD916037SApr 13, 2021
Cover of seal cap for reaction chamber for semiconductor
KOKUSAI ELECTRIC CORP9 citations86
USD939459SDec 28, 2021
Boat for wafer processing apparatus
KOKUSAI ELECTRIC CORP15 citations85
US10424520B1Sep 24, 2019
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP15 citations85
US10453735B2Oct 22, 2019
Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording medium
KOKUSAI ELECTRIC CORP8 citations84
US11453942B2Sep 27, 2022
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP1 citations73
US10961625B2Mar 30, 2021
Substrate processing apparatus, reaction tube and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations73
US10808318B2Oct 20, 2020
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP3 citations73
US11685992B2Jun 27, 2023
Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations72
US12203167B2Jan 21, 2025
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US11898247B2Feb 13, 2024
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11859280B2Jan 2, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US10978361B2Apr 13, 2021
Substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12540388B2Feb 3, 2026
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12053805B2Aug 6, 2024
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12546002B2Feb 10, 2026
Reaction tube, substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations59
HITACHI INT ELECTRIC INC
8 patentsUS9412582B2Aug 9, 2016
Reaction tube, substrate processing apparatus, and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC464 citations98
USD739832SSep 29, 2015
Reaction tube
HITACHI INT ELECTRIC INC34 citations94
USD872037SJan 7, 2020
Cover of seal cap for reaction chamber for semiconductor manufacturing
HITACHI INT ELECTRIC INC9 citations84
USD847301SApr 30, 2019
Return nozzle
HITACHI INT ELECTRIC INC7 citations84
USD843958SMar 26, 2019
Reaction tube
HITACHI INT ELECTRIC INC8 citations84
USD842823SMar 12, 2019
Reaction tube
HITACHI INT ELECTRIC INC9 citations84
US9163309B2Oct 20, 2015
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC5 citations73
US10388512B2Aug 20, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations62
SASAKI TAKAFUMI
5 patentsUS9096061B2Aug 4, 2015
Droplet discharge head, and image-forming apparatus
SASAKI TAKAFUMI9 citations84
US10336053B2Jul 2, 2019
Control apparatus for three dimensional object fabrication apparatus, control method for three-dimensional object fabrication apparatus, and three-dimensional object fabrication system
SASAKI TAKAFUMI6 citations73
US9919475B2Mar 20, 2018
Three-dimensional printing apparatus, three-dimensional object forming method, and three-dimensional object
SASAKI TAKAFUMI4 citations73
US8414097B2Apr 9, 2013
Image forming apparatus selecting pulses to form drive waveform
SASAKI TAKAFUMI5 citations73
US11084274B2Aug 10, 2021
Three-dimensional shaping apparatus, method for controlling three-dimensional shaping apparatus, and recording medium
SASAKI TAKAFUMI1 citations62
FANUC LTD
4 patentsUS7283889B2Oct 16, 2007
Numerical control device, and numerical control method
FANUC LTD29 citations92
US8041447B2Oct 18, 2011
Numerical controller having workpiece setting error compensation means
FANUC LTD13 citations84
US7239938B2Jul 3, 2007
Interference checking for a numerical control device
FANUC LTD9 citations74
US7269473B2Sep 11, 2007
Work installation error measuring apparatus
FANUC LTD2 citations63
RICOH CO LTD
4 patentsUS11045976B2Jun 29, 2021
Apparatus for producing three-dimensional objects, method for producing three-dimensional objects, and non-transitory recording medium
RICOH CO LTD2 citations71
US8042911B2Oct 25, 2011
Liquid dispenser head, liquid dispensing unit using same, and image forming apparatus using same
RICOH CO LTD5 citations63
US8033657B2Oct 11, 2011
Image forming apparatus including liquid discharge head unit
RICOH CO LTD5 citations63
US11426929B2Aug 30, 2022
Powder material for producing three-dimensional object, kit for producing three-dimensional object, and three-dimensional object producing method and apparatus
RICOH CO LTD1 citations54
OTSUKI TOSHIAKI
3 patentsUS9063536B2Jun 23, 2015
Numerical controller having workpiece mounting error compensation unit for three-axis machine tool
OTSUKI TOSHIAKI7 citations83
US8255078B2Aug 28, 2012
Numerical controller for multi-axis machine tool
OTSUKI TOSHIAKI9 citations83
US8868228B2Oct 21, 2014
Numerical controller having speed control function for multi-axis machining device
OTSUKI TOSHIAKI3 citations63
FANUC CORP
2 patentsTOKYO SHIBAURA ELECTRIC CO
2 patentsSAIDO SHUHEI
1 patentYAMANAKA KUNIHIRO
1 patentHARA DAISUKE
1 patentKURIBAYASHI KOEI
1 patentYUASA KAZUHIRO
1 patentMITSUI MINING & SMELTING CO LTD
1 patentPARK SOYOUNG
1 patentShowing the top 50 of 69 patents by PatentIndex Score.