Inventor · disambiguated record
Ming-Chun Laio
Also filed as: LAIO MING-CHUN
2 granted patents·1 pending application·16 citations·filing 2003–2006
57Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0161US6696750B1Semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 24, 2004·13 cites·11 claims
- 0246US7126229B2Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Oct 24, 2006·3 cites·9 claims
- 0344US2007007669A1Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →