Inventor
KAMIO KUNIMASA
JP30 patents
Patents
30 patentsUS4360649ANov 23, 1982
Curable composition
SUMITOMO CHEMICAL CO60 citations94
US5399715AMar 21, 1995
Polyamino oligomers and polymaleimide compounds
SUMITOMO CHEMICAL CO31 citations92
US5300592AApr 5, 1994
Thermosetting resin composition and a composite material comprising cured product and said resin composition and its matrix
SUMITOMO CHEMICAL CO37 citations92
US4900848AFeb 13, 1990
Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols
SUMITOMO CHEMICAL CO32 citations92
US4808717AFeb 28, 1989
Thermosetting resin composition
SUMITOMO CHEMICAL CO30 citations92
US4410457AOct 18, 1983
Conductive paste
SUMITOMO CHEMICAL CO77 citations92
US5478871ADec 26, 1995
Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same
SUMITOMO CHEMICAL CO27 citations91
US4980436ADec 25, 1990
Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide
SUMITOMO CHEMICAL CO19 citations82
US4960860AOct 2, 1990
Imide compound and composition containing the same
SUMITOMO CHEMICAL CO17 citations82
US4855339AAug 8, 1989
Epoxy resin composition
SUMITOMO CHEMICAL CO20 citations81
US4632966ADec 30, 1986
Thermosetting resin composition of an allylated novolak and a bis-maleimide
SUMITOMO CHEMICAL CO18 citations81
US4913697AApr 3, 1990
Thermosetting resin composition from alkenylaryloxy triazine
SUMITOMO CHEMICAL CO8 citations74
US4871832AOct 3, 1989
Thermosettable imide compound and epoxy resin composition containing the same
SUMITOMO CHEMICAL CO8 citations74
US4755569AJul 5, 1988
Thermosetting resin composition comprising a partly allylated novolac epoxy resin and bismaleimide
SUMITOMO CHEMICAL CO13 citations74
US4529790AJul 16, 1985
Epoxy resin composition
SUMITOMO CHEMICAL CO9 citations74
US5109087AApr 28, 1992
Aromatic allyl amine thermosetting resin composition
SUMITOMO CHEMICAL CO5 citations73
US5041507AAug 20, 1991
Thermosetting resin composition composed of a polymaleimide compound, a phenolic novolac resin and an epoxy resin
SUMITOMO CHEMICAL CO8 citations73
US4957995ASep 18, 1990
Low-viscosity epoxy resin, and fiber-reinforced composite material based on m-alkyl triglycidylaminophenols
SUMITOMO CHEMICAL CO14 citations73
US4888407ADec 19, 1989
Imide compound and composition containing the same
SUMITOMO CHEMICAL CO8 citations71
US4794148ADec 27, 1988
Fiber-reinforced composite material
SUMITOMO CHEMICAL CO10 citations71
US4705833ANov 10, 1987
Thermosettable heat-resistant resin compositions
SUMITOMO CHEMICAL CO9 citations70
US4621123ANov 4, 1986
Phosphinylmethyl polypenols and polyglycidyl ethers thereof
SUMITOMO CHEMICAL CO18 citations68
US5329047AJul 12, 1994
Aromatic allyl amine thermosetting resin composition
SUMITOMO CHEMICAL CO4 citations62
US4337367AJun 29, 1982
Oligomer of m-isopropenylphenol
SUMITOMO CHEMICAL CO3 citations62
US4260831AApr 7, 1981
Oligomerization of m-isopropenylphenol
SUMITOMO CHEMICAL CO4 citations62
US4211715AJul 8, 1980
Epoxy resins and process for producing the same
SUMITOMO CHEMICAL CO2 citations62
US4908417AMar 13, 1990
Thermosetting resin composition
SUMITOMO CHEMICAL CO4 citations61
US4931515AJun 5, 1990
Method for producing encapsulated semiconductor from improved epoxy resins
SUMITOMO CHEMICAL CO2 citations60
US4108924AAug 22, 1978
Stabilized chlorine-containing resin composition
SUMITOMO CHEMICAL CO2 citations60
US4408086AOct 4, 1983
Oligomerization of m-isopropenylphenol
SUMITOMO CHEMICAL CO1 citations51