Inventor · disambiguated record
Kabirkumar Mirpuri
Also filed as: MIRPURI KABIRKUMAR · MIRPURI KABIRKUMAR J
4 granted patents·5 pending applications·1 citations·filing 2011–2016
57Inventor score
Top patents by PatentIndex Score
9 records- 0156US9504168B2Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding processNAGARAJAN SIVAKUMAR·Filed 2011·Granted Nov 22, 2016·1 cites·12 claims
- 0245US9324680B2Solder attach apparatus and methodINTEL CORP·Filed 2013·Granted Apr 26, 2016·0 cites·18 claims
- 0344US9659889B2Solder-on-die using water-soluble resist system and methodINTEL CORP·Filed 2013·Granted May 23, 2017·0 cites·6 claims
- 0441US10008419B2Separation method, computer storage medium, and separation systemOKADA SHINJI·Filed 2012·Granted Jun 26, 2018·0 cites·11 claims
- 0540US2017042043A1Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding processNAGARAJAN SIVAKUMAR·Filed 2016·Application pending·0 cites
- 0639US2016260679A1Hybrid interconnect for low temperature attachINTEL CORP·Filed 2014·Application pending·0 cites
- 0738US2016240506A1Solder attach apparatus and methodINTEL CORP·Filed 2016·Application pending·0 cites
- 0837US2015001706A1Systems and methods for avoiding protrusions in injection molded solderMIRPURI KABIRKUMAR·Filed 2013·Application pending·0 cites
- 0929US2017053858A1Substrate on substrate packageINTEL CORP·Filed 2015·Application pending·0 cites
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