US2017042043A1PendingUtilityA1

Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process

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Assignee: NAGARAJAN SIVAKUMARPriority: Sep 30, 2011Filed: Oct 21, 2016Published: Feb 9, 2017
Est. expirySep 30, 2031(~5.2 yrs left)· nominal 20-yr term from priority
Inventors:Sivakumar NagarajanSandeep RazdanNisha AnanthakrishnanCraig J. WeinmanKabirkumar Mirpuri
H10W 90/734H10W 90/732H10W 90/724H10W 90/722H10W 72/07338H10W 72/07336H10W 72/07332H10W 72/07236H10W 72/07232H10W 72/07141H10W 72/952H10W 72/354H10W 72/353H10W 72/325H10W 72/252H10W 72/241H10W 72/0198H10W 72/073H10W 72/072H10W 72/29H10W 74/47H10W 74/15H10W 74/012H10W 74/01C09J 2463/00C08K 9/06H05K 3/4611H05K 3/3436H05K 3/3489C08K 2201/005C08G 59/4238C08G 59/42Y10T29/49146C09J 2203/326Y10T29/49144C09J 5/06C08L 63/00C08G 59/38C08G 59/245H05K 3/3494C08G 2190/00H01L 23/293H01L 2224/83192H01L 2224/2919H01L 2224/81203H01L 2224/83801H01L 2224/81801H01L 24/81H01L 2224/92143H01L 24/83H01L 21/563H01L 2224/32225H01L 24/92H01L 2224/32145H01L 2224/16145H01L 2224/81191H01L 2924/0665H01L 2224/83203H01L 2924/01029H01L 2224/16227H01L 2224/73204
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Claims

Abstract

A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method comprising:
 forming a fluxing-encapsulant material comprising:
 one or more epoxy resins having multiple functional groups and an epoxy equivalent weight (EEW) of 150-1,000; 
 a curing agent having a functional group selected from the group consisting of anhydride, acid and amine; and 
 a fluxing agent having a mono-carboxylic acid or di-carboxylic acid, and a pKa of 4-5. 
   
     
     
         2 . The method of  claim 1 , wherein the fluxing-encapsulant material further comprises 60-70% by weight of a filler having a surface coating which is non-reactive with the multiple functional groups of the one or more epoxy resins. 
     
     
         3 . The method of  claim 1 , wherein the one or more epoxy resins is a di-functional epoxy resin or a tri-functional epoxy resin. 
     
     
         4 . The method of  claim 1 , wherein the one or more epoxy resins comprises a mixture of a di-functional epoxy resin and a tri-functional epoxy resin. 
     
     
         5 . The method of  claim 1 , wherein the curing agent is a cyclic acid anhydride. 
     
     
         6 . The method of  claim 5 , wherein the cyclic acid anhydride is selected from the group consisting of succinic anhydride, benzoic anhydride and phthalic anhydride, and their hydrogenated versions. 
     
     
         7 . The method of  claim 2 , wherein:
 the one or more epoxy resins comprises a di-functional epoxy resin or tri-functional epoxy resin;   the cyclic acid anhydride is selected from the group consisting of succinic anhydride, benzoic anhydride and phthalic anhydride; and   the filler has a maximum particle size less than 5 microns.

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