Inventor · disambiguated record
Sandeep Razdan
Also filed as: RAZDAN SANDEEP
28 granted patents·6 pending applications·171 citations·filing 2007–2022
95Inventor score
Files withCISCO TECH INC17INTEL CORP7TYCO ELECTRONICS CORP5NAGARAJAN SIVAKUMAR2RAMALINGAM SURIYAKALA1
Top patents by PatentIndex Score
34 records- 0198US11762155B2Photonics packaging platformCISCO TECH INC·Filed 2021·Granted Sep 19, 2023·20 cites·20 claims
- 0297US8987918B2Interconnect structures with polymer coreINTEL CORP·Filed 2013·Granted Mar 24, 2015·54 cites·25 claims
- 0396US10393959B1Photonic integrated circuit bonded with interposerCISCO TECH INC·Filed 2018·Granted Aug 27, 2019·18 cites·20 claims
- 0495US9964719B1Fan-out wafer level integration for photonic chipsCISCO TECH INC·Filed 2017·Granted May 8, 2018·15 cites·19 claims
- 0593US10877219B1Periscope optical assemblyCISCO TECH INC·Filed 2019·Granted Dec 29, 2020·9 cites·19 claims
- 0693US10145758B2Wafer level optical probing structures for silicon photonicsCISCO TECH INC·Filed 2017·Granted Dec 4, 2018·12 cites·19 claims
- 0791US11043478B2Integrated circuit bridge for photonics and electrical chip integrationCISCO TECH INC·Filed 2018·Granted Jun 22, 2021·7 cites·7 claims
- 0889US10962719B2Passive fiber to chip coupling using post-assembly laser patterned waveguidesCISCO TECH INC·Filed 2019·Granted Mar 30, 2021·6 cites·19 claims
- 0987US11181689B2Low temperature solder in a photonic deviceCISCO TECH INC·Filed 2019·Granted Nov 23, 2021·5 cites·20 claims
- 1087US9791640B2Interposer with separable interfaceTYCO ELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·6 cites·16 claims
- 1184US11029475B2Frame lid for in-package opticsCISCO TECH INC·Filed 2019·Granted Jun 8, 2021·4 cites·20 claims
- 1283US10727368B2Optoelectronic device module having a silicon interposerINTEL CORP·Filed 2016·Granted Jul 28, 2020·4 cites·16 claims
- 1379US10564352B1Photonic integrated circuit bonded with interposerCISCO TECH INC·Filed 2019·Granted Feb 18, 2020·2 cites·20 claims
- 1475US9335494B2Optoelectronics structuresTYCO ELECTRONICS CORP·Filed 2014·Granted May 10, 2016·3 cites·16 claims
- 1574US9310555B2Mode size converters and methods of fabricating the sameTYCO ELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·3 cites·13 claims
- 1669US11756861B2Thermal packaging with fan out wafer level processingCISCO TECH INC·Filed 2022·Granted Sep 12, 2023·0 cites·10 claims
- 1767US11226450B2Periscope optical assemblyCISCO TECH INC·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 1866US11784175B2Integrated circuit bridge for photonics and electrical chip integrationCISCO TECH INC·Filed 2021·Granted Oct 10, 2023·0 cites·17 claims
- 1964US11831093B2Socket locatorCISCO TECH INC·Filed 2021·Granted Nov 28, 2023·0 cites·17 claims
- 2061US11373930B2Thermal packaging with fan out wafer level processingCISCO TECH INC·Filed 2020·Granted Jun 28, 2022·0 cites·15 claims
- 2160US8377550B2Flip chip package containing novel underfill materialsINTEL CORP·Filed 2009·Granted Feb 19, 2013·2 cites·20 claims
- 2256US9504168B2Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding processNAGARAJAN SIVAKUMAR·Filed 2011·Granted Nov 22, 2016·1 cites·12 claims
- 2355US10128225B2Interconnect structures with polymer coreINTEL CORP·Filed 2017·Granted Nov 13, 2018·0 cites·7 claims
- 2451US9613934B2Interconnect structures with polymer coreINTEL CORP·Filed 2015·Granted Apr 4, 2017·0 cites·10 claims
- 2550US11215775B2Connection features for electronic and optical packagingCISCO TECH INC·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 2649US11391888B2Wafer-scale fabrication of optical apparatusCISCO TECH INC·Filed 2019·Granted Jul 19, 2022·0 cites·23 claims
- 2747US8143339B2Nanocomposite polymersWARNER STEVEN B·Filed 2007·Granted Mar 27, 2012·0 cites·27 claims
- 2845US2015212267A1Optical AssemblyTYCO ELECTRONICS NEDERLAND BV·Filed 2014·Application pending·0 cites
- 2945US2016062039A1Mode size converters and optical assembliesTYCO ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3042US2010155935A1Protective coating for semiconductor substratesINTEL CORP·Filed 2008·Application pending·0 cites
- 3140US2017042043A1Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding processNAGARAJAN SIVAKUMAR·Filed 2016·Application pending·0 cites
- 3237US8895365B2Techniques and configurations for surface treatment of an integrated circuit substrateRAMALINGAM SURIYAKALA·Filed 2012·Granted Nov 25, 2014·0 cites·10 claims
- 3333US2017195043A1Optical test port based upon nanocrystal-in-glass-materialTYCO ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3433US2017288780A1Optoelectronic transceiver assembliesINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →