Inventor · disambiguated record
Wing-Cheong Gilbert Lai
Also filed as: LAI WING-CHEONG · LAI WING-CHEONG G · LAI WING-CHEONG GILBERT
11 granted patents·1 pending application·218 citations·filing 1996–2013
91Inventor score
Files withMICRON TECHNOLOGY INC9APPLIED MATERIALS INC1GELATOS AVGERINOS V1NANO & ADVANCED MATERIALS INST LTD1
Top patents by PatentIndex Score
12 records- 0194US7732327B2Vapor deposition of tungsten materialsAPPLIED MATERIALS INC·Filed 2008·Granted Jun 8, 2010·58 cites·25 claims
- 0288US5607722AProcess for titanium nitride deposition using five-and six-coordinate titanium complexesMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 4, 1997·67 cites·13 claims
- 0380US5866205AProcess for titanium nitride deposition using five- and six-coordinate titanium complexesMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 2, 1999·44 cites·7 claims
- 0478US7217661B2Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 2005·Granted May 15, 2007·3 cites·13 claims
- 0574US7560816B2Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 14, 2009·2 cites·27 claims
- 0673US6946393B2Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 20, 2005·10 cites·18 claims
- 0770US8821637B2Temperature controlled lid assembly for tungsten nitride depositionGELATOS AVGERINOS V·Filed 2008·Granted Sep 2, 2014·3 cites·14 claims
- 0870US6187673B1Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 13, 2001·22 cites·9 claims
- 0964US6774487B2Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 10, 2004·5 cites·34 claims
- 1062US7276795B2Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·4 cites·23 claims
- 1151US7737024B2Small grain size, conformal aluminum interconnects and method for their formationMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 15, 2010·0 cites·33 claims
- 1241US2015118409A1Release film with enhanced mechanical properties and method in preparing thereofNANO & ADVANCED MATERIALS INST LTD·Filed 2013·Application pending·0 cites
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