Inventor
Yeh Jia-Fong
TW3 patents
Patents
3 patentsUS9978673B2May 22, 2018
Package structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations68
US11404361B2Aug 2, 2022
Method for fabricating package structure having encapsulate sensing chip
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US10872847B2Dec 22, 2020
Package structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations59