Package structure and method for fabricating the same

Abstract

A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.

What is claimed is: 
     
       1. A package structure, comprising:
 a carrier being a circuit board; 
 an electronic component disposed on the circuit board and having a sensing surface; 
 at least one conductive element disposed on the circuit board, wherein the conductive element is a bonding wire segment or a loop-type bonding wire; 
 an encapsulant formed on the carrier and encapsulating the electronic component and the conductive element, with the sensing surface of the electronic component and a portion of a surface of the conductive element exposed from the encapsulant; and 
 a conductive layer formed on the encapsulant and electrically connecting the conductive element and the electronic component. 
 
     
     
       2. The package structure of  claim 1 , wherein the electronic component is a fingerprint identification chip. 
     
     
       3. The package structure of  claim 1 , wherein the conductive element is electrically connected to the carrier. 
     
     
       4. The package structure of  claim 1 , further comprising an opening formed in the encapsulant to expose the portion of the surface of the conductive element. 
     
     
       5. The package structure of  claim 1 , further comprising a plurality of conductive pads disposed on one side of the circuit board. 
     
     
       6. The package structure of  claim 5 , wherein the electronic component, the conductive element and the encapsulant are disposed on the other opposite side of the circuit board. 
     
     
       7. A package structure, comprising:
 a lead frame having a die attach pad and a plurality of leads; 
 an electronic component disposed on the die attach pad and having a sensing surface; 
 at least one conductive element disposed on the leads, wherein the conductive element is a bonding wire segment or a loop-type bonding wire; 
 an encapsulant formed on the lead frame and encapsulating the electronic component and the conductive element, with the sensing surface of the electronic component and a portion of a surface of the conductive element exposed from the encapsulant; and 
 a conductive layer formed on the encapsulant and electrically connecting the conductive element and the electronic component. 
 
     
     
       8. The package structure of  claim 7 , wherein the electronic component is a fingerprint identification chip. 
     
     
       9. The package structure of  claim 7 , wherein the conductive element is electrically connected to the leads. 
     
     
       10. The package structure of  claim 7 , further comprising an opening formed in the encapsulant to expose the portion of the surface of the conductive element.