Inventor · disambiguated record
Shao-Tzu Tang
Also filed as: TANG SHAO-TZU
15 granted patents·4 pending applications·16 citations·filing 2001–2024
88Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD15ALLIED IND CORP LTD1HSIAO WEI-CHUNG1PREC IND CO LTD SILICONWARE1TANG SHAO-TZU1
Top patents by PatentIndex Score
19 records- 0196US12068535B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 20, 2024·4 cites·37 claims
- 0283US12438266B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·39 claims
- 0375US9978673B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted May 22, 2018·3 cites·26 claims
- 0474US9699910B2Circuit structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jul 4, 2017·2 cites·5 claims
- 0572US9362217B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jun 7, 2016·3 cites·10 claims
- 0668US9991197B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 5, 2018·1 cites·9 claims
- 0767US10872847B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 22, 2020·1 cites·10 claims
- 0863US11404361B2Method for fabricating package structure having encapsulate sensing chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·12 claims
- 0960US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 1057US10201090B2Fabrication method of circuit structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 5, 2019·0 cites·9 claims
- 1157US2025022809A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1254US6433176B1Method for making 8-hydroxyjulolidine compoundALLIED IND CORP LTD·Filed 2001·Granted Aug 13, 2002·1 cites·11 claims
- 1353US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 1448US10224243B2Method of fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 5, 2019·0 cites·11 claims
- 1547US9265154B2Packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 1647US2014091462A1Semiconductor package and fabrication method thereofPREC IND CO LTD SILICONWARE·Filed 2012·Application pending·0 cites
- 1746US9805979B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 31, 2017·0 cites·5 claims
- 1846US2023027120A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Application pending·0 cites
- 1937US2013292832A1Semiconductor package and fabrication method thereofTANG SHAO-TZU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →