P

Inventor

LIU CHI-CHUN

US103 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHI-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

45 patents
US8853085B1Oct 7, 2014

Grapho-epitaxy DSA process with dimension control of template pattern

IBM47 citations97
US9576817B1Feb 21, 2017

Pattern decomposition for directed self assembly patterns templated by sidewall image transfer

IBM40 citations94
US9536750B1Jan 3, 2017

Method for fin formation with a self-aligned directed self-assembly process and cut-last scheme

IBM14 citations93
US9831324B1Nov 28, 2017

Self-aligned inner-spacer replacement process using implantation

IBM14 citations92
US8859433B2Oct 14, 2014

DSA grapho-epitaxy process with etch stop material

IBM21 citations91
US10461154B1Oct 29, 2019

Bottom isolation for nanosheet transistors on bulk substrate

IBM9 citations84
US10410875B2Sep 10, 2019

Alternating hardmasks for tight-pitch line formation

IBM4 citations84
US10199464B2Feb 5, 2019

Techniques for VFET top source/drain epitaxy

IBM6 citations84
US9852260B2Dec 26, 2017

Method and recording medium of reducing chemoepitaxy directed self-assembled defects

IBM6 citations84
US9768059B1Sep 19, 2017

High-chi block copolymers for interconnect structures by directed self-assembly

IBM12 citations84
US9368350B1Jun 14, 2016

Tone inverted directed self-assembly (DSA) fin patterning

IBM12 citations84
US10256320B1Apr 9, 2019

Vertical field-effect-transistors having a silicon oxide layer with controlled thickness

IBM11 citations83
US10157789B2Dec 18, 2018

Via formation using sidewall image transfer process to define lateral dimension

IBM12 citations83
US10103022B2Oct 16, 2018

Alternating hardmasks for tight-pitch line formation

IBM8 citations83
US10090378B1Oct 2, 2018

Efficient metal-insulator-metal capacitor

IBM4 citations83
US9632408B1Apr 25, 2017

Graphoepitaxy directed self assembly

IBM15 citations83
US9490168B1Nov 8, 2016

Via formation using sidewall image transfer process to define lateral dimension

IBM10 citations83
US8715917B2May 6, 2014

Simultaneous photoresist development and neutral polymer layer formation

IBM8 citations81
US11600325B2Mar 7, 2023

Non volatile resistive memory logic device

IBM2 citations73
US11139242B2Oct 5, 2021

Via-to-metal tip connections in multi-layer chips

IBM2 citations73
US10892328B2Jan 12, 2021

Source/drain extension regions and air spacers for nanosheet field-effect transistor structures

IBM5 citations73
US10833180B2Nov 10, 2020

Self-aligned tunneling field effect transistors

IBM2 citations73
US10755976B2Aug 25, 2020

Field effect device with reduced capacitance and resistance in source/drain contacts at reduced gate pitch

IBM3 citations73
US10606980B2Mar 31, 2020

Method and recording medium of reducing chemoepitaxy directed self-assembled defects

IBM1 citations73
US10475905B2Nov 12, 2019

Techniques for vertical FET gate length control

IBM4 citations73
US10381267B2Aug 13, 2019

Field effect device with reduced capacitance and resistance in source/drain contacts at reduced gate pitch

IBM3 citations73
US10312103B2Jun 4, 2019

Alternating hardmasks for tight-pitch line formation

IBM1 citations73
US10242881B2Mar 26, 2019

Self-aligned single dummy fin cut with tight pitch

IBM3 citations73
US10170591B2Jan 1, 2019

Self-aligned finFET formation

IBM1 citations73
US10134762B2Nov 20, 2018

Embedded security circuit formed by directed self-assembly

IBM2 citations73
US10114921B2Oct 30, 2018

Method and recording medium of reducing chemoepitaxy directed self-assembled defects

IBM3 citations73
US9947548B2Apr 17, 2018

Self-aligned single dummy fin cut with tight pitch

IBM2 citations73
US9917106B2Mar 13, 2018

Embedded security circuit formed by directed self-assembly

IBM2 citations73
US9911603B2Mar 6, 2018

Pattern decomposition for directed self assembly patterns templated by sidewall image transfer

IBM2 citations73
US9659824B2May 23, 2017

Graphoepitaxy directed self-assembly process for semiconductor fin formation

IBM2 citations73
US10580652B2Mar 3, 2020

Alternating hardmasks for tight-pitch line formation

IBM2 citations72
US10374034B1Aug 6, 2019

Undercut control in isotropic wet etch processes

IBM5 citations72
US10059820B2Aug 28, 2018

Hybrid topographical and chemical pre-patterns for directed self-assembly of block copolymers

IBM3 citations72
US9810980B1Nov 7, 2017

Graphoepitaxy directed self assembly

IBM3 citations72
US11239077B2Feb 1, 2022

Litho-etch-litho-etch with self-aligned blocks

IBM2 citations71
US9738765B2Aug 22, 2017

Hybrid topographical and chemical pre-patterns for directed self-assembly of block copolymers

IBM4 citations71
US11329001B2May 10, 2022

Embedded chip identification formed by directed self-assembly

IBM0 citations63
US11004737B2May 11, 2021

Field effect device with reduced capacitance and resistance in source/drain contacts at reduced gate pitch

IBM0 citations63
US10916630B2Feb 9, 2021

Nanosheet devices with improved electrostatic integrity

IBM0 citations63
US9929020B2Mar 27, 2018

Method for fin formation with a self-aligned directed self-assembly process and cut-last scheme

IBM1 citations63

GUILLORN MICHAEL A

2 patents

TESSERA INC

2 patents

TESSERA LLC

1 patent

Showing the top 50 of 103 patents by PatentIndex Score.