Inventor
LIN CHUN-NENG
TW44 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUN-NENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
43 patentsUS11522083B2Dec 6, 2022
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11201084B2Dec 14, 2021
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11488857B2Nov 1, 2022
Semiconductor device and method of manufacture using a contact etch stop layer (CESL) breakthrough process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11276571B2Mar 15, 2022
Method of breaking through etch stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12376372B2Jul 29, 2025
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369348B2Jul 22, 2025
Fin Field-Effect Transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12317525B2May 27, 2025
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12308248B2May 20, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278288B2Apr 15, 2025
Fin field-effect transistor device having hybrid work function layer stack
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12183823B2Dec 31, 2024
Fin field-effect transistor with a gate structure having a dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12136566B2Nov 5, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080556B2Sep 3, 2024
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051619B2Jul 30, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051753B2Jul 30, 2024
Fin field-effect transistor device having hybrid work function layer stack
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051626B2Jul 30, 2024
Fin Field-Effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12021145B2Jun 25, 2024
Fin field-effect transistor device having hybrid work function layer stack
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996470B2May 28, 2024
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978801B2May 7, 2024
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901441B2Feb 13, 2024
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855193B2Dec 26, 2023
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817330B2Nov 14, 2023
Method for processing substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11749753B2Sep 5, 2023
Methods of forming a semiconductor device with a gate structure having a dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11735425B2Aug 22, 2023
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11588041B2Feb 21, 2023
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11398391B2Jul 26, 2022
Substrate processing apparatus and method for processing substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11380793B2Jul 5, 2022
Fin field-effect transistor device having hybrid work function layer stack
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11309185B2Apr 19, 2022
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11309190B2Apr 19, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11227940B2Jan 18, 2022
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12469789B2Nov 11, 2025
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12381081B2Aug 5, 2025
Method of breaking through etch stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12272598B2Apr 8, 2025
Conductive feature of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12068385B2Aug 20, 2024
Oxidation to mitigate dry etch and/or wet etch fluorine residue
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11996324B2May 28, 2024
Conductive feature of a semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11901180B2Feb 13, 2024
Method of breaking through etch stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11854870B2Dec 26, 2023
Etch method for interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11587875B2Feb 21, 2023
Connecting structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10971628B2Apr 6, 2021
FinFET device with T-shaped fin
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10522662B1Dec 31, 2019
FinFET device with T-shaped fin and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12362227B2Jul 15, 2025
Method for improving profile of interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11848239B2Dec 19, 2023
Patterning method and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12237400B2Feb 25, 2025
Method of forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11424185B2Aug 23, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51