Inventor

CHEN HSIN-YU

TW157 patents

⚠️ This page may combine multiple inventors who share the name “CHEN HSIN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN HSIN-YU

TAIWAN SEMICONDUCTOR MFG CO LTD

Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation

Self-alignment for redistribution layer

Semiconductor device having backside interconnect structure through substrate via and method of forming the same

Multifunctional collimator for contact image sensors

Photomask assembly and method of forming the same

Pellicle frame with stress relief trenches

Photomask assembly and method of forming the same

Anti-stiction process for MEMS device

Semiconductor device having backside interconnect structure on through substrate via and method of forming the same

Anti-stiction process for MEMS device

Semiconductor device having backside interconnect structure on through substrate via and method of forming the same

Substrateless integrated circuit packages and methods of forming same

Heater design for MEMS chamber pressure control

Selective nitride outgassing process for MEMS cavity pressure control

Substrateless integrated circuit packages and methods of forming same

Electrostatic discharge circuits and methods for operating the same

Electrostatic discharge circuits and methods for operating the same

Multifunctional collimator for contact image sensors

Multifunctional collimator for contact image sensors

UNITED MICROELECTRONICS CORP

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device including barrier layer and manufacturing method thereof

Semiconductor device and method for fabricating the same

Method for fabricating semiconductor device

Manufacturing method of semiconductor device

FinFET device having single diffusion break structure

Method for fabricating semiconductor device

Method of forming a single-crystal nanowire finFET

Method of fabricating a semiconductor device with fin-shaped structures

Method for forming photomasks

TAIWAN SEMICONDUCTOR MFG

TSV structures and methods for forming the same

Methods of forming semiconductor structures

Interconnect structure and method of forming same

CHEN HSIN-YU

Sealing cover for containers

Shelf for stereo

Interconnect structure and method

LIN YUNG-CHI

TSV structures and methods for forming the same

(unassigned)

Vacuum indicator for a bottle

GOOGLE LLC

Seamless transition for multiple display refresh rates

ACER INC

Lighting stick

ADVANCED RISC MACH LTD

Memory device and method of controlling leakage current within such a memory device

LIN JING-CHENG

Copper bump structures having sidewall protection layers

QUANTA COMP INC

Exposure control system and associated exposure control method

CHANG HSIN

Reconfigurable guide pin design for centering wafers having different sizes

IDGUNJI SACHIN SATISH

Improving read stability of a semiconductor memory

HUANG KUO-HSIUNG

Through silicon via and method of forming the same