Inventor
OPPERMANN KLAUS-GUENTER
DE30 patents
⚠️ This page may combine multiple inventors who share the name “OPPERMANN KLAUS-GUENTER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
14 patentsUS7288435B2Oct 30, 2007
Method for producing a cover, method for producing a packaged device
INFINEON TECHNOLOGIES AG89 citations97
US6762455B2Jul 13, 2004
Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor component
INFINEON TECHNOLOGIES AG47 citations92
US6556418B2Apr 29, 2003
Micromechanical component and process for its fabrication
INFINEON TECHNOLOGIES AG20 citations91
US7234237B2Jun 26, 2007
Method for producing a protective cover for a device
INFINEON TECHNOLOGIES AG8 citations73
US6955950B2Oct 18, 2005
Method for generating a protective cover for a device
INFINEON TECHNOLOGIES AG9 citations73
US6939734B2Sep 6, 2005
Method for producing a protective cover for a device
INFINEON TECHNOLOGIES AG7 citations73
US6401544B2Jun 11, 2002
Micromechanical component protected from environmental influences
INFINEON TECHNOLOGIES AG12 citations73
US6724058B2Apr 20, 2004
Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the method
INFINEON TECHNOLOGIES AG3 citations63
US7682777B2Mar 23, 2010
Method for producing a polymer structure on a substrate surface
INFINEON TECHNOLOGIES AG2 citations62
US6406933B1Jun 18, 2002
Production method for micromechanical components
INFINEON TECHNOLOGIES AG4 citations61
US6346429B1Feb 12, 2002
Method for fabricating integrated sensors
INFINEON TECHNOLOGIES AG6 citations61
US8884437B2Nov 11, 2014
Electrical device with protruding contact elements and overhang regions over a cavity
INFINEON TECHNOLOGIES AG0 citations52
US7851333B2Dec 14, 2010
Apparatus comprising a device and method for producing it
INFINEON TECHNOLOGIES AG0 citations52
US9312212B2Apr 12, 2016
Method for housing an electronic component in a device package and an electronic component housed in the device package
INFINEON TECHNOLOGIES AG0 citations51
SIEMENS AG
7 patentsUS5994751ANov 30, 1999
Photodiode having reduced series resistance, and method for fabrication thereof
SIEMENS AG32 citations92
US5519241AMay 21, 1996
Circuit structure having at least one bipolar power component and method for the operation thereof
SIEMENS AG31 citations92
US5385852AJan 31, 1995
Method for manufacturing vertical MOS transistors
SIEMENS AG30 citations92
US6373115B1Apr 16, 2002
Micromechanical structure, sensor and method for manufacturing the same
SIEMENS AG16 citations83
US5747867AMay 5, 1998
Integrated circuit structure with interconnect formed along walls of silicon island
SIEMENS AG11 citations74
US5291040AMar 1, 1994
Deactivatable thyristor with turn-off current path
SIEMENS AG19 citations69
US5760424AJun 2, 1998
Integrated circuit arrangement having at least one IGBT
SIEMENS AG5 citations63
OPPERMANN KLAUS-GUENTER
5 patentsUS8501534B2Aug 6, 2013
Method for housing an electronic component in a device package and an electronic component housed in the device package
OPPERMANN KLAUS-GUENTER2 citations60
US8319344B2Nov 27, 2012
Electrical device with protruding contact elements and overhang regions over a cavity
OPPERMANN KLAUS-GUENTER0 citations51
US8618621B2Dec 31, 2013
Semiconductor device layer structure and method of fabrication
OPPERMANN KLAUS-GUENTER0 citations50
US8188548B2May 29, 2012
Device and method for reducing a voltage dependent capacitive coupling
OPPERMANN KLAUS-GUENTER0 citations50
US8148055B2Apr 3, 2012
Method for developing a photoresist
OPPERMANN KLAUS-GUENTER0 citations40