P

Inventor

VON KOBLINSKI CARSTEN

AT49 patents
⚠️ This page may combine multiple inventors who share the name “VON KOBLINSKI CARSTEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

29 patents
US7202107B2Apr 10, 2007

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

INFINEON TECHNOLOGIES AG108 citations96
US7767495B2Aug 3, 2010

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

INFINEON TECHNOLOGIES AG31 citations93
US7622733B2Nov 24, 2009

Semiconductor structure with a plastic housing and separable carrier plate

INFINEON TECHNOLOGIES AG32 citations91
US10615040B2Apr 7, 2020

Superjunction structure in a power semiconductor device

INFINEON TECHNOLOGIES AG3 citations73
US10433736B2Oct 8, 2019

Implantable vessel fluid sensor

INFINEON TECHNOLOGIES AG5 citations73
US9601376B2Mar 21, 2017

Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portion

INFINEON TECHNOLOGIES AG2 citations73
US11302579B2Apr 12, 2022

Composite wafer, semiconductor device and electronic component

INFINEON TECHNOLOGIES AG1 citations72
US10672664B2Jun 2, 2020

Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device

INFINEON TECHNOLOGIES AG2 citations72
US9847235B2Dec 19, 2017

Semiconductor device with plated lead frame, and method for manufacturing thereof

INFINEON TECHNOLOGIES AG3 citations71
US10332814B2Jun 25, 2019

Bonded system and a method for adhesively bonding a hygroscopic material

INFINEON TECHNOLOGIES AG2 citations68
US9391263B2Jul 12, 2016

Semiconductor devices having insulating substrates and methods of formation thereof

INFINEON TECHNOLOGIES AG2 citations63
US11848237B2Dec 19, 2023

Composite wafer, semiconductor device and electronic component

INFINEON TECHNOLOGIES AG0 citations62
US11527468B2Dec 13, 2022

Semiconductor oxide or glass based connection body with wiring structure

INFINEON TECHNOLOGIES AG0 citations62
US11393784B2Jul 19, 2022

Semiconductor package devices and method for forming semiconductor package devices

INFINEON TECHNOLOGIES AG0 citations62
US11342433B2May 24, 2022

Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices

INFINEON TECHNOLOGIES AG0 citations62
US11148943B2Oct 19, 2021

Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces

INFINEON TECHNOLOGIES AG0 citations62
US8025783B2Sep 27, 2011

Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements

INFINEON TECHNOLOGIES AG3 citations62
US12094837B2Sep 17, 2024

Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material

INFINEON TECHNOLOGIES AG0 citations60
US11605599B2Mar 14, 2023

Semiconductor device having a thin semiconductor die

INFINEON TECHNOLOGIES AG0 citations60
US11322400B2May 3, 2022

Roughening of a metallization layer on a semiconductor wafer

INFINEON TECHNOLOGIES AG0 citations60
US7460704B2Dec 2, 2008

Device for stabilizing a workpiece during processing

INFINEON TECHNOLOGIES AG4 citations54
US9608201B2Mar 28, 2017

Semiconductor devices having insulating substrates and methods of formation thereof

INFINEON TECHNOLOGIES AG0 citations52
US8039313B2Oct 18, 2011

Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate

INFINEON TECHNOLOGIES AG0 citations52
US10431471B2Oct 1, 2019

Method of planarizing a semiconductor wafer and semiconductor wafer

INFINEON TECHNOLOGIES AG0 citations51
US10128204B2Nov 13, 2018

RF module

INFINEON TECHNOLOGIES AG1 citations51
US10112861B2Oct 30, 2018

Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrate

INFINEON TECHNOLOGIES AG1 citations51
US10748787B2Aug 18, 2020

Semiconductor device with plated lead frame

INFINEON TECHNOLOGIES AG0 citations50
US9117801B2Aug 25, 2015

Semiconductor devices having a glass substrate, and method for manufacturing thereof

INFINEON TECHNOLOGIES AG1 citations49
US12415719B2Sep 16, 2025

MEMS sensor with particle filter and method for producing it

INFINEON TECHNOLOGIES AG0 citations47

VON KOBLINSKI CARSTEN

5 patents

INFINEON TECHNOLOGIES AUSTRIA AG

5 patents

INFINEON TECHNOLOGIES AUSTRIA

3 patents

KROENER FRIEDRICH

2 patents

BREYMESSER ALEXANDER

2 patents

BASELL POLOLEFINE GMBH

1 patent

AUSSERLECHNER UDO

1 patent

HELLMUND OLIVER

1 patent