Inventor
WOODS JR WAYNE H
US55 patents
⚠️ This page may combine multiple inventors who share the name “WOODS JR WAYNE H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS10680581B2Jun 9, 2020
RF signal switching, phase shifting and polarization control
IBM7 citations84
US9813264B2Nov 7, 2017
Millimeter wave phase shifters using tunable transmission lines
IBM6 citations84
US9800434B2Oct 24, 2017
Millimeter wave phase shifters using tunable transmission lines
IBM5 citations84
US9171121B2Oct 27, 2015
Method, structure, and design structure for a through-silicon-via Wilkinson power divider
IBM12 citations84
US8789003B1Jul 22, 2014
Millimeter wave phase shifters using tunable transmission lines
IBM17 citations84
US8680689B1Mar 25, 2014
Coplanar waveguide for stacked multi-chip systems
IBM10 citations84
US7844418B2Nov 30, 2010
Methods for distributing a random variable using statistically-correct spatial interpolation
IBM9 citations83
US9035719B2May 19, 2015
Three dimensional branchline coupler using through silicon vias and design structures
IBM11 citations81
US10608335B2Mar 31, 2020
RF signal switching, phase shifting and polarization control
IBM6 citations73
US10009202B1Jun 26, 2018
Direct RF demodulation
IBM2 citations73
US9461612B2Oct 4, 2016
Reconfigurable rat race coupler
IBM3 citations73
US9059679B2Jun 16, 2015
Tunable interconnect structures, and integrated circuit containing the same
IBM4 citations73
US8859300B2Oct 14, 2014
On chip inductor with frequency dependent inductance
IBM2 citations63
US8378448B2Feb 19, 2013
Chip inductor with frequency dependent inductance
IBM4 citations63
US8907470B2Dec 9, 2014
Millimeter wave wafer level chip scale packaging (WLCSP) device and related method
IBM2 citations62
US7487473B2Feb 3, 2009
Enabling netlist for modeling of technology dependent BEOL process variation
IBM3 citations58
US10284402B2May 7, 2019
Direct RF demodulation
IBM0 citations52
US9595936B2Mar 14, 2017
Reconfigurable bandstop filter
IBM1 citations52
US9466868B2Oct 11, 2016
Reconfigurable branch line coupler
IBM0 citations52
US9236361B2Jan 12, 2016
Millimeter wave wafer level chip scale packaging (WLCSP) device
IBM0 citations52
US9159692B2Oct 13, 2015
Millimeter wave wafer level chip scale packaging (WLCSP) device and related method
IBM0 citations52
US9054157B2Jun 9, 2015
High performance on-chip vertical coaxial cable, method of manufacture and design structure
IBM0 citations52
US9087717B2Jul 21, 2015
Tunnel field-effect transistors with a gate-swing broken-gap heterostructure
IBM0 citations51
DING HANYI
10 patentsUS8193878B2Jun 5, 2012
Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance
DING HANYI16 citations92
US8188808B2May 29, 2012
Compact on-chip branchline coupler using slow wave transmission line
DING HANYI12 citations84
US8138857B2Mar 20, 2012
Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance
DING HANYI10 citations84
US8106728B2Jan 31, 2012
Circuit structure and design structure for an optionally switchable on-chip slow wave transmission line band-stop filter and a method of manufacture
DING HANYI9 citations80
US8898605B2Nov 25, 2014
On-chip tunable transmission lines, methods of manufacture and design structures
DING HANYI4 citations73
US8791771B2Jul 29, 2014
Reconfigurable Wilkinson power divider and design structure thereof
DING HANYI4 citations73
US8508314B2Aug 13, 2013
On-chip variable delay transmission line with fixed characteristic impedance
DING HANYI4 citations63
US8476988B2Jul 2, 2013
Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance
DING HANYI4 citations63
US8436446B2May 7, 2013
Method, structure, and design structure for a through-silicon-via Wilkinson power divider
DING HANYI1 citations63
US8216912B2Jul 10, 2012
Method, structure, and design structure for a through-silicon-via Wilkinson power divider
DING HANYI0 citations52
GLAIVERF INC
8 patentsUS12155105B2Nov 26, 2024
TSV phase shifter
GLAIVERF INC4 citations74
US11973257B2Apr 30, 2024
Wearable accessory with phased array antenna system
GLAIVERF INC3 citations74
US11063353B2Jul 13, 2021
E-fuse phase shifter and e-fuse phased array
GLAIVERF INC2 citations72
US12066860B2Aug 20, 2024
Wearable accessory with phased array antenna system
GLAIVERF INC0 citations62
US11777208B2Oct 3, 2023
E-fuse switched-delay path phased array
GLAIVERF INC0 citations62
US11409113B2Aug 9, 2022
Wearable accessory with phased array antenna system
GLAIVERF INC0 citations62
US11404765B2Aug 2, 2022
Retractable phased array for mobile devices
GLAIVERF INC0 citations62
US11303012B2Apr 12, 2022
Mobile device case with phased array antenna system
GLAIVERF INC0 citations62
MINA ESSAM
3 patentsUS8760245B2Jun 24, 2014
Coplanar waveguide structures with alternating wide and narrow portions having different thicknesses, method of manufacture and design structure
MINA ESSAM2 citations62
US8963657B2Feb 24, 2015
On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure
MINA ESSAM0 citations51
US8766748B2Jul 1, 2014
Microstrip line structures with alternating wide and narrow portions having different thicknesses relative to ground, method of manufacture and design structures
MINA ESSAM0 citations51
WANG GUOAN
2 patentsUS8164397B2Apr 24, 2012
Method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications
WANG GUOAN4 citations61
US8130059B2Mar 6, 2012
On chip slow-wave structure, method of manufacture and design structure
WANG GUOAN4 citations61
SUN PINPING
1 patentWOODS JR WAYNE H
1 patentCOHN JOHN M
1 patentBAVISI AMIT
1 patentShowing the top 50 of 55 patents by PatentIndex Score.