Inventor
DEGUCHI YOSHINORI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “DEGUCHI YOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
12 patentsUS9053954B2Jun 9, 2015
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP8 citations82
US10777507B2Sep 15, 2020
Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the same
RENESAS ELECTRONICS CORP3 citations73
US8896129B2Nov 25, 2014
Semiconductor device and manufacturing method for the same
RENESAS ELECTRONICS CORP5 citations72
US9490218B2Nov 8, 2016
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP3 citations71
US11387172B2Jul 12, 2022
Semiconductor device and method for manufacturing the same
RENESAS ELECTRONICS CORP3 citations69
US9171767B2Oct 27, 2015
Semiconductor device and manufacturing method for the same
RENESAS ELECTRONICS CORP3 citations62
US9825017B2Nov 21, 2017
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP1 citations61
US9230938B2Jan 5, 2016
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations61
US8945953B2Feb 3, 2015
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations61
US10818601B1Oct 27, 2020
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations52
US10141295B2Nov 27, 2018
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US11456264B2Sep 27, 2022
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations47
MITSUBISHI ELECTRIC CORP
5 patentsUS6633176B2Oct 14, 2003
Semiconductor device test probe having improved tip portion and manufacturing method thereof
MITSUBISHI ELECTRIC CORP47 citations95
US7274195B2Sep 25, 2007
Semiconductor device test probe
MITSUBISHI ELECTRIC CORP26 citations92
US6356096B2Mar 12, 2002
Test board for testing a semiconductor device utilizing first and second delay elements in a signal-transmission-path
MITSUBISHI ELECTRIC CORP35 citations92
US7276923B2Oct 2, 2007
Semiconductor device test probe
MITSUBISHI ELECTRIC CORP12 citations83
US6628127B2Sep 30, 2003
Probe card for testing semiconductor integrated circuit and method of manufacturing the same
MITSUBISHI ELECTRIC CORP9 citations73
RENESAS TECH CORP
4 patentsUS6727714B2Apr 27, 2004
Probe card
RENESAS TECH CORP13 citations84
US7423439B2Sep 9, 2008
Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
RENESAS TECH CORP12 citations83
US7701063B2Apr 20, 2010
Semiconductor device
RENESAS TECH CORP5 citations62
US7534629B2May 19, 2009
Manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP4 citations60