Inventor
YANG KAI-MING
TW40 patents
⚠️ This page may combine multiple inventors who share the name “YANG KAI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
34 patentsUS11516910B1Nov 29, 2022
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP4 citations72
US11445617B2Sep 13, 2022
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations72
US11127664B2Sep 21, 2021
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations71
US12414243B2Sep 9, 2025
Manufacturing method of package structure
UNIMICRON TECHNOLOGY CORP0 citations62
US11943877B2Mar 26, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US11637047B2Apr 25, 2023
Manufacturing method of chip package structure
UNIMICRON TECHNOLOGY CORP0 citations62
US11462452B2Oct 4, 2022
Chip package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US11424216B2Aug 23, 2022
Electronic device bonding structure and fabrication method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US10658282B2May 19, 2020
Package substrate structure and bonding method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US12504591B2Dec 23, 2025
Co-packaged structure for optics and electrics
UNIMICRON TECHNOLOGY CORP0 citations61
US12266616B2Apr 1, 2025
Integrated circuit package structure
UNIMICRON TECHNOLOGY CORP0 citations60
US11523503B2Dec 6, 2022
Wiring board and method of forming hole thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US11013103B2May 18, 2021
Method for forming circuit board stacked structure
UNIMICRON TECHNOLOGY CORP0 citations60
US10993332B2Apr 27, 2021
Circuit substrate
UNIMICRON TECHNOLOGY CORP1 citations60
US12255279B2Mar 18, 2025
Light-emitting diode package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US12218017B2Feb 4, 2025
Glass carrier having protection structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US11410933B2Aug 9, 2022
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US10756050B2Aug 25, 2020
Package structure and bonding method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US10588214B2Mar 10, 2020
Stacked structure and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations52
US11764344B2Sep 19, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US11476234B2Oct 18, 2022
Chip package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US10897823B2Jan 19, 2021
Circuit board, package structure and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations51
US12160953B2Dec 3, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11710690B2Jul 25, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11682612B2Jun 20, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11665832B2May 30, 2023
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11219130B2Jan 4, 2022
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11166387B2Nov 2, 2021
Wiring board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11895780B2Feb 6, 2024
Manufacturing method of package structure
UNIMICRON TECHNOLOGY CORP0 citations49
US11764120B2Sep 19, 2023
Chip packaging structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49
US10178755B2Jan 8, 2019
Circuit board stacked structure and method for forming the same
UNIMICRON TECHNOLOGY CORP0 citations49
US12438060B2Oct 7, 2025
Chip package and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations47
US12369250B2Jul 22, 2025
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations47
US11682658B2Jun 20, 2023
Light-emitting package and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations46