Inventor

TSENG TZYY-JANG

TW100 patents

⚠️ This page may combine multiple inventors who share the name “TSENG TZYY-JANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG TZYY-JANG

UNIMICRON TECHNOLOGY CORP

Packaging substrate having embedded through-via interposer

Electrical device package structure and method of fabricating the same

Method of fabricating a through-holed interposer

Inspection apparatus for bare circuit board

Circuit board structure

Circuit carrier and manufacturing method thereof and package structure

Chip package structure

Package structure with structure reinforcing element and manufacturing method thereof

Method of fabricating packaging substrate having embedded through-via interposer

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Circuit board and manufacturing method thereof

Light emitting diode package structure and manufacturing method thereof

Probe card testing device

Package structure and manufacturing method thereof

Coreless packaging substrate and method of fabricating the same

Circuit board and manufacturing method thereof

Manufacturing method of package structure

Circuit substrate structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Manufacturing method of carrier structure

Package structure with structure reinforcing element and manufacturing method thereof

Package structure with structure reinforcing element and manufacturing method thereof

Carrier structure and manufacturing method thereof

Package substrate structure and bonding method thereof

Through-holed interposer, packaging substrate, and methods of fabricating the same

Composite circuit substrate structure

Manufacturing method of circuit board structure

Circuit board structure and manufacturing method thereof

Circuit board structure

Method of manufacturing circuit board structure

Light emitting diode package structure

TSENG TZYY-JANG

Coreless package substrate and fabrication method thereof

Package structure, fabricating method thereof, and package-on-package device thereby

Packaging substrate and method of fabricating the same

Semiconductor package structure and fabricating method of semiconductor package structure

Manufacturing method of circuit board

Semiconductor package structure and method of fabricating the same

Process for fabricating a circuit board

Circuit board and process for fabricating the same

Circuit structure

WORLD WISER ELECTRONICS INC

Printed circuit board with thermal conductive structure

Method of forming thermal conductive structure on printed circuit board

HU YU-SHAN

Fabrication method of packaging substrate having through-holed interposer embedded therein

Packaging substrate having through-holed interposer embedded therein and fabrication method thereof

HU DYI-CHUNG

Packaging substrate having embedded through-via interposer and method of fabricating the same

Interposed substrate and manufacturing method thereof

EXPRESS PACKAGING SYSTEMS INC

Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate

HARVATEK CORP

LED light source with reflecting side wall

IND TECH RES INST

Multi-layer printed circuit board and method for fabricating the same