P

Inventor

ZUO CHENGJIE

US109 patents
⚠️ This page may combine multiple inventors who share the name “ZUO CHENGJIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

35 patents
US9807882B1Oct 31, 2017

Density-optimized module-level inductor ground structure

QUALCOMM INC21 citations94
US9449753B2Sep 20, 2016

Varying thickness inductor

QUALCOMM INC33 citations94
US10283257B2May 7, 2019

Skewed co-spiral inductor structure

QUALCOMM INC12 citations84
US10242957B2Mar 26, 2019

Compartment shielding in flip-chip (FC) module

QUALCOMM INC13 citations84
US9893048B2Feb 13, 2018

Passive-on-glass (POG) device and method

QUALCOMM INC7 citations84
US9620463B2Apr 11, 2017

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

QUALCOMM INC10 citations84
US9425761B2Aug 23, 2016

High pass filters and low pass filters using through glass via technology

QUALCOMM INC9 citations84
US9370103B2Jun 14, 2016

Low package parasitic inductance using a thru-substrate interposer

QUALCOMM INC9 citations84
US9101068B2Aug 4, 2015

Two-stage power delivery architecture

QUALCOMM INC14 citations84
US10325855B2Jun 18, 2019

Backside drill embedded die substrate

QUALCOMM INC10 citations83
US9203373B2Dec 1, 2015

Diplexer design using through glass via technology

QUALCOMM INC8 citations82
US10290414B2May 14, 2019

Substrate comprising an embedded inductor and a thin film magnetic core

QUALCOMM INC6 citations73
US10163771B2Dec 25, 2018

Interposer device including at least one transistor and at least one through-substrate via

QUALCOMM INC4 citations73
US10103135B2Oct 16, 2018

Backside ground plane for integrated circuit

QUALCOMM INC3 citations73
US10069474B2Sep 4, 2018

Encapsulation of acoustic resonator devices

QUALCOMM INC4 citations73
US10049815B2Aug 14, 2018

Nested through glass via transformer

QUALCOMM INC2 citations73
US9966426B2May 8, 2018

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

QUALCOMM INC4 citations73
US9959964B2May 1, 2018

Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications

QUALCOMM INC6 citations73
US9954267B2Apr 24, 2018

Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter

QUALCOMM INC4 citations73
US9930783B2Mar 27, 2018

Passive device assembly for accurate ground plane control

QUALCOMM INC2 citations73
US9875848B2Jan 23, 2018

MIM capacitor and method of making the same

QUALCOMM INC4 citations73
US9660110B2May 23, 2017

Varactor device with backside contact

QUALCOMM INC3 citations73
US9368564B2Jun 14, 2016

3D pillar inductor

QUALCOMM INC5 citations73
US9355967B2May 31, 2016

Stress compensation patterning

QUALCOMM INC5 citations73
US9275786B2Mar 1, 2016

Superposed structure 3D orthogonal through substrate inductor

QUALCOMM INC5 citations73
US10044390B2Aug 7, 2018

Glass substrate including passive-on-glass device and semiconductor die

QUALCOMM INC2 citations71
US9906318B2Feb 27, 2018

Frequency multiplexer

QUALCOMM INC3 citations71
US9813043B2Nov 7, 2017

Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods

QUALCOMM INC3 citations71
US9634640B2Apr 25, 2017

Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods

QUALCOMM INC3 citations71
US10312193B2Jun 4, 2019

Package comprising switches and filters

QUALCOMM INC4 citations70
US10171112B2Jan 1, 2019

RF multiplexer with integrated directional couplers

QUALCOMM INC2 citations70
US10944379B2Mar 9, 2021

Hybrid passive-on-glass (POG) acoustic filter

QUALCOMM INC0 citations63
US10553671B2Feb 4, 2020

3D pillar inductor

QUALCOMM INC1 citations63
US10498307B2Dec 3, 2019

Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor

QUALCOMM INC1 citations63
US10249580B2Apr 2, 2019

Stacked substrate inductor

QUALCOMM INC1 citations63

ZUO CHENGJIE

6 patents

ANHUI ANUKI TECH CO LTD

4 patents

QUALCOMM MEMS TECHNOLOGIES INC

3 patents

LO CHI SHUN

2 patents

Showing the top 50 of 109 patents by PatentIndex Score.