Inventor
ZUO CHENGJIE
US109 patents
⚠️ This page may combine multiple inventors who share the name “ZUO CHENGJIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
35 patentsUS9807882B1Oct 31, 2017
Density-optimized module-level inductor ground structure
QUALCOMM INC21 citations94
US9449753B2Sep 20, 2016
Varying thickness inductor
QUALCOMM INC33 citations94
US10283257B2May 7, 2019
Skewed co-spiral inductor structure
QUALCOMM INC12 citations84
US10242957B2Mar 26, 2019
Compartment shielding in flip-chip (FC) module
QUALCOMM INC13 citations84
US9893048B2Feb 13, 2018
Passive-on-glass (POG) device and method
QUALCOMM INC7 citations84
US9620463B2Apr 11, 2017
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
QUALCOMM INC10 citations84
US9425761B2Aug 23, 2016
High pass filters and low pass filters using through glass via technology
QUALCOMM INC9 citations84
US9370103B2Jun 14, 2016
Low package parasitic inductance using a thru-substrate interposer
QUALCOMM INC9 citations84
US9101068B2Aug 4, 2015
Two-stage power delivery architecture
QUALCOMM INC14 citations84
US10325855B2Jun 18, 2019
Backside drill embedded die substrate
QUALCOMM INC10 citations83
US9203373B2Dec 1, 2015
Diplexer design using through glass via technology
QUALCOMM INC8 citations82
US10290414B2May 14, 2019
Substrate comprising an embedded inductor and a thin film magnetic core
QUALCOMM INC6 citations73
US10163771B2Dec 25, 2018
Interposer device including at least one transistor and at least one through-substrate via
QUALCOMM INC4 citations73
US10103135B2Oct 16, 2018
Backside ground plane for integrated circuit
QUALCOMM INC3 citations73
US10069474B2Sep 4, 2018
Encapsulation of acoustic resonator devices
QUALCOMM INC4 citations73
US10049815B2Aug 14, 2018
Nested through glass via transformer
QUALCOMM INC2 citations73
US9966426B2May 8, 2018
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
QUALCOMM INC4 citations73
US9959964B2May 1, 2018
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
QUALCOMM INC6 citations73
US9954267B2Apr 24, 2018
Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
QUALCOMM INC4 citations73
US9930783B2Mar 27, 2018
Passive device assembly for accurate ground plane control
QUALCOMM INC2 citations73
US9875848B2Jan 23, 2018
MIM capacitor and method of making the same
QUALCOMM INC4 citations73
US9660110B2May 23, 2017
Varactor device with backside contact
QUALCOMM INC3 citations73
US9368564B2Jun 14, 2016
3D pillar inductor
QUALCOMM INC5 citations73
US9355967B2May 31, 2016
Stress compensation patterning
QUALCOMM INC5 citations73
US9275786B2Mar 1, 2016
Superposed structure 3D orthogonal through substrate inductor
QUALCOMM INC5 citations73
US10044390B2Aug 7, 2018
Glass substrate including passive-on-glass device and semiconductor die
QUALCOMM INC2 citations71
US9906318B2Feb 27, 2018
Frequency multiplexer
QUALCOMM INC3 citations71
US9813043B2Nov 7, 2017
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
QUALCOMM INC3 citations71
US9634640B2Apr 25, 2017
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
QUALCOMM INC3 citations71
US10312193B2Jun 4, 2019
Package comprising switches and filters
QUALCOMM INC4 citations70
US10171112B2Jan 1, 2019
RF multiplexer with integrated directional couplers
QUALCOMM INC2 citations70
US10944379B2Mar 9, 2021
Hybrid passive-on-glass (POG) acoustic filter
QUALCOMM INC0 citations63
US10553671B2Feb 4, 2020
3D pillar inductor
QUALCOMM INC1 citations63
US10498307B2Dec 3, 2019
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor
QUALCOMM INC1 citations63
US10249580B2Apr 2, 2019
Stacked substrate inductor
QUALCOMM INC1 citations63
ZUO CHENGJIE
6 patentsUS8816567B2Aug 26, 2014
Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppression
ZUO CHENGJIE200 citations98
US9099986B2Aug 4, 2015
Cross-sectional dilation mode resonators
ZUO CHENGJIE7 citations82
US9130505B2Sep 8, 2015
Multi-frequency reconfigurable voltage controlled oscillator (VCO) and method of providing same
ZUO CHENGJIE4 citations72
US8987976B2Mar 24, 2015
Piezoelectric resonator having combined thickness and width vibrational modes
ZUO CHENGJIE4 citations72
US9496255B2Nov 15, 2016
Stacked CMOS chipset having an insulating layer and a secondary layer and method of forming same
ZUO CHENGJIE2 citations61
US9270254B2Feb 23, 2016
Cross-sectional dilation mode resonators and resonator-based ladder filters
ZUO CHENGJIE2 citations60
ANHUI ANUKI TECH CO LTD
4 patentsUS12094631B2Sep 17, 2024
Chip inductor and method for manufacturing same
ANHUI ANUKI TECH CO LTD2 citations73
US12199352B2Jan 14, 2025
Tuning circuit and communication device
ANHUI ANUKI TECH CO LTD0 citations62
US12334632B2Jun 17, 2025
Antenna assembly and communication system
ANHUI ANUKI TECH CO LTD0 citations59
US11929725B2Mar 12, 2024
Bandpass filter circuit and multiplexer
ANHUI ANUKI TECH CO LTD1 citations59
QUALCOMM MEMS TECHNOLOGIES INC
3 patentsUS9363902B2Jun 7, 2016
Three-dimensional multilayer solenoid transformer
QUALCOMM MEMS TECHNOLOGIES INC6 citations84
US9337799B2May 10, 2016
Selective tuning of acoustic devices
QUALCOMM MEMS TECHNOLOGIES INC8 citations83
US9136574B2Sep 15, 2015
Compact 3-D coplanar transmission lines
QUALCOMM MEMS TECHNOLOGIES INC2 citations63
LO CHI SHUN
2 patentsShowing the top 50 of 109 patents by PatentIndex Score.