Inventor
NGUYEN SON
US87 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN SON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
21 patentsUS7088003B2Aug 8, 2006
Structures and methods for integration of ultralow-k dielectrics with improved reliability
IBM563 citations99
US10777411B1Sep 15, 2020
Semiconductor device with selective dielectric deposition
IBM20 citations94
US9786760B1Oct 10, 2017
Air gap and air spacer pinch off
IBM22 citations94
US5622596AApr 22, 1997
High density selective SiO2 :Si3 N4 etching using a stoichiometrically altered nitride etch stop
IBM23 citations91
US10483344B1Nov 19, 2019
Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers
IBM8 citations84
US10242933B2Mar 26, 2019
Air gap and air spacer pinch off
IBM4 citations84
US9793193B1Oct 17, 2017
Air gap and air spacer pinch off
IBM7 citations84
US7915180B2Mar 29, 2011
SiCOH film preparation using precursors with built-in porogen functionality
IBM8 citations84
US7674521B2Mar 9, 2010
Materials containing voids with void size controlled on the nanometer scale
IBM9 citations84
US7521377B2Apr 21, 2009
SiCOH film preparation using precursors with built-in porogen functionality
IBM11 citations84
US9040411B2May 26, 2015
Advanced low k cap film formation process for nano electronic devices
IBM4 citations83
US7202564B2Apr 10, 2007
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
IBM11 citations83
US11942426B2Mar 26, 2024
Semiconductor structure having alternating selective metal and dielectric layers
IBM2 citations73
US10541151B1Jan 21, 2020
Disposable laser/flash anneal absorber for embedded neuromorphic memory device fabrication
IBM2 citations73
US10957850B2Mar 23, 2021
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication
IBM6 citations72
US10692925B2Jun 23, 2020
Dielectric fill for memory pillar elements
IBM3 citations72
US10643890B2May 5, 2020
Ultrathin multilayer metal alloy liner for nano Cu interconnects
IBM3 citations72
US11171054B2Nov 9, 2021
Selective deposition with SAM for fully aligned via
IBM3 citations70
US12419079B2Sep 16, 2025
Field effect transistor with backside source/drain
IBM0 citations63
US11908734B2Feb 20, 2024
Composite interconnect formation using graphene
IBM0 citations63
US10903307B2Jan 26, 2021
Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers
IBM1 citations63
ANCORA HEART INC
4 patentsUS9706996B2Jul 18, 2017
Multi-window guide tunnel
ANCORA HEART INC14 citations92
US10058321B2Aug 28, 2018
Devices and methods of visualizing and determining depth of penetration in cardiac tissue
ANCORA HEART INC20 citations91
US10542987B2Jan 28, 2020
Multi-window guide tunnel
ANCORA HEART INC8 citations84
US10980529B2Apr 20, 2021
Devices and methods of visualizing and determining depth of penetration in cardiac tissue
ANCORA HEART INC2 citations70
LOJACK OPERATING CO LP
3 patentsUS7593711B2Sep 22, 2009
Vehicle locating unit with improved power management method
LOJACK OPERATING CO LP24 citations88
US7853218B2Dec 14, 2010
Vehicle locating unit with improved power management method
LOJACK OPERATING CO LP13 citations80
US7511606B2Mar 31, 2009
Vehicle locating unit with input voltage protection
LOJACK OPERATING CO LP7 citations68
HARITON ILIA
2 patentsEDWARDS LIFESCIENCES CORP
2 patentsGUNUKULA NAVEEN
2 patentsNGUYEN HUU
1 patentCISCO TECH IND
1 patentLSI LOGIC CORP
1 patentHAMILTON CO
1 patent(unassigned)
1 patentMETHODE ELECTRONICS INC
1 patentLIN WEI
1 patentSUL CHINSONG
1 patentGATES STEPHEN M
1 patentCOFFY TIM
1 patentAPPLIED MATERIALS INC
1 patentMAYNARD JEFF
1 patentHARVARD COLLEGE
1 patentZYWIE INC
1 patentSILICON STORAGE TECH INC
1 patentBOEING CO
1 patentShowing the top 50 of 87 patents by PatentIndex Score.