P

Inventor

NGUYEN SON

US87 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN SON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

21 patents
US7088003B2Aug 8, 2006

Structures and methods for integration of ultralow-k dielectrics with improved reliability

IBM563 citations99
US10777411B1Sep 15, 2020

Semiconductor device with selective dielectric deposition

IBM20 citations94
US9786760B1Oct 10, 2017

Air gap and air spacer pinch off

IBM22 citations94
US5622596AApr 22, 1997

High density selective SiO2 :Si3 N4 etching using a stoichiometrically altered nitride etch stop

IBM23 citations91
US10483344B1Nov 19, 2019

Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers

IBM8 citations84
US10242933B2Mar 26, 2019

Air gap and air spacer pinch off

IBM4 citations84
US9793193B1Oct 17, 2017

Air gap and air spacer pinch off

IBM7 citations84
US7915180B2Mar 29, 2011

SiCOH film preparation using precursors with built-in porogen functionality

IBM8 citations84
US7674521B2Mar 9, 2010

Materials containing voids with void size controlled on the nanometer scale

IBM9 citations84
US7521377B2Apr 21, 2009

SiCOH film preparation using precursors with built-in porogen functionality

IBM11 citations84
US9040411B2May 26, 2015

Advanced low k cap film formation process for nano electronic devices

IBM4 citations83
US7202564B2Apr 10, 2007

Advanced low dielectric constant organosilicon plasma chemical vapor deposition films

IBM11 citations83
US11942426B2Mar 26, 2024

Semiconductor structure having alternating selective metal and dielectric layers

IBM2 citations73
US10541151B1Jan 21, 2020

Disposable laser/flash anneal absorber for embedded neuromorphic memory device fabrication

IBM2 citations73
US10957850B2Mar 23, 2021

Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication

IBM6 citations72
US10692925B2Jun 23, 2020

Dielectric fill for memory pillar elements

IBM3 citations72
US10643890B2May 5, 2020

Ultrathin multilayer metal alloy liner for nano Cu interconnects

IBM3 citations72
US11171054B2Nov 9, 2021

Selective deposition with SAM for fully aligned via

IBM3 citations70
US12419079B2Sep 16, 2025

Field effect transistor with backside source/drain

IBM0 citations63
US11908734B2Feb 20, 2024

Composite interconnect formation using graphene

IBM0 citations63
US10903307B2Jan 26, 2021

Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers

IBM1 citations63

ANCORA HEART INC

4 patents

LOJACK OPERATING CO LP

3 patents

HARITON ILIA

2 patents

EDWARDS LIFESCIENCES CORP

2 patents

GUNUKULA NAVEEN

2 patents

NGUYEN HUU

1 patent

CISCO TECH IND

1 patent

LSI LOGIC CORP

1 patent

HAMILTON CO

1 patent

(unassigned)

1 patent

METHODE ELECTRONICS INC

1 patent

LIN WEI

1 patent

SUL CHINSONG

1 patent

GATES STEPHEN M

1 patent

COFFY TIM

1 patent

APPLIED MATERIALS INC

1 patent

MAYNARD JEFF

1 patent

HARVARD COLLEGE

1 patent

ZYWIE INC

1 patent

SILICON STORAGE TECH INC

1 patent

BOEING CO

1 patent

Showing the top 50 of 87 patents by PatentIndex Score.