Inventor

LI HONGQI

US44 patents

⚠️ This page may combine multiple inventors who share the name “LI HONGQI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI HONGQI

MICRON TECHNOLOGY INC

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

Semiconductor constructions and methods of forming intersecting lines of material

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

Devices including floating vias and related systems and methods

Low capacitance interconnect structures and associated systems and methods

Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices

Multitier arrangements of integrated devices, and methods of forming sense/access lines

Multitier arrangements of integrated devices, and methods of forming sense/access lines

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

Multitier arrangements of integrated devices, and methods of forming sense/access lines

Interconnect assemblies with through-silicon vias and stress-relief features

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

On-pitch vias for semiconductor devices and associated devices and systems

Devices including floating vias

On-pitch vias for semiconductor devices and associated devices and systems

Fabrication of electrodes for memory cells

Fabrication of electrodes for memory cells

Slit oxide and via formation techniques

Slit oxide and via formation techniques

Polishing apparatuses and polishing methods

Polishing apparatuses

Low capacitance interconnect structures and associated systems and methods

Semiconductor constructions

Devices, systems and methods for manufacturing through-substrate vias and front-side structures

Devices, systems and methods for manufacturing through-substrate vias and front-side structures

NEWPORT CORP

Integrated picomotor mount

Integral preload mechanism for piezoelectric actuator

Integral preload mechanism for piezoelectric actuator

LI HONGQI

Capping poly channel pillars in stacked circuits

Methods of exposing conductive vias of semiconductor devices and associated structures

Post-tungsten CMP cleaning solution and method of using the same

NUCTECH CO LTD

Traction device and traction method

Vehicle traction system and radiation imaging check system

CASEY SHAWN E

Information storage device with a damping insert sheet between a housing bay and a disk drive

YANG JIAN

Disk drive actuator having a bobbin contacting a closed coil periphery at two locations

ZHANG QING

Depopulated disk drive head stack assembly having a necked dummy mass with relief alcoves

NGUYEN DIEP L

Method for fabricating a disk drive base for a disk drive

SONY CORP

Method for forming a metal cap in a semiconductor memory device

WESTERN DIGITAL TECH INC

Information storage device with a damping insert sheet between a housing bay and a disk drive

TIAN JIFANG

Devices and methods for system-level disk drive vibration and shock testing

UNIV TSINGHUA

Fork-arm lift tractor

INTEL CORP

Capping poly channel pillars in stacked circuits

JINDAL ANURAG

Integrated circuit substrates comprising through-substrate vias and methods of forming through-substrate vias