Inventor

HSU WEN-SUNG

TW67 patents

⚠️ This page may combine multiple inventors who share the name “HSU WEN-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU WEN-SUNG

MEDIATEK INC

Semiconductor package structure with antenna

Fan-out package structure with integrated antenna

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package, semiconductor device using the same and manufacturing method thereof

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package

Semiconductor package with improved heat dissipation

Semiconductor package and method for fabricating the same

Semiconductor package having an interposer in which one or more dies are formed and method of forming the same

Semiconductor chip package and fabrication method thereof

Fan-out package structure with integrated antenna

Semiconductor package structure with antenna

Semiconductor chip package and fabrication method thereof

Chip scale package structure and method of forming the same

Semiconductor package with antenna and fabrication method thereof

Semiconductor package using flip-chip technology

Semiconductor package with rigid under bump metallurgy (UBM) stack

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

Structure and formation method of chip package structure

Packaging substrate with block-type via and semiconductor packages having the same

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

Semiconductor package, semiconductor device using the same and manufacturing method thereof

Semiconductor package

Semiconductor package with layer structures, antenna layer and electronic component

Semiconductor package

Fan-out package structure having stacked carrier substrates and method for forming the same

Chip package, package substrate and manufacturing method thereof

Semiconductor package

Semiconductor package using flip-chip technology

Semiconductor package with layer structures, antenna layer and electronic component

Chip scale package structure and method of forming the same

Semiconductor package structure

Innovative air gap for antenna fan out package

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

Manufacturing method of semiconductor package and manufacturing method of semiconductor device

Chip package having a patterned conducting plate and method for forming the same

Semiconductor device and manufacturing method thereof

Lidded semiconductor package

Semiconductor package structure

VIA TECH INC

Circuit carrier and package structure thereof

ZANG RUEY KAE

Semiconductor package assembly systems and methods using DAM and trench structures