Inventor

LIN TSUNG-SHU

TW99 patents

⚠️ This page may combine multiple inventors who share the name “LIN TSUNG-SHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN TSUNG-SHU

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and method of forming the same

Fan-out stacked system in package (SIP) having dummy dies and methods of making the same

Integrated fan-out structure and method of forming

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor device and method of manufacture

Routing design of dummy metal cap and redistribution line

Package with bridge die for interconnection and method forming same

Semiconductor device and method of manufacture

Package structure and method and equipment for forming the same

Contact pad for semiconductor device

Package structure

Semiconductor device methods of manufacture

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor structure and manufacturing method thereof

Heat spreading device and method

Integrated fan-out structure and method of forming

Devices employing thermal and mechanical enhanced layers and methods of forming same

Contact pad for semiconductor device

Bumps for chip scale packaging including under bump metal structures with different diameters

Semiconductor device and manufacturing method thereof

Routing design of dummy metal cap and redistribution line

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor package with lid structure

Package structure including through via structures

Contact pad for semiconductor device

Package structure and method and equipment for forming the same

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure having line connected via portions

Semiconductor structure

Heat spreading device and method

Contact pad for semiconductor device

Semiconductor package and method of forming the same

Integrated fan-out structure and method of forming

Integrated fan-out structure and method of forming

Stacked via structure disposed on a conductive pillar of a semiconductor die

Routing design of dummy metal cap and redistribution line

Semiconductor package and manufacturing method thereof

Integrated circuit package and method

Package structure and method of manufacturing the same

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG

Package device including an opening in a flexible substrate and methods of forming the same

LIN WEN YI

Ring structure for chip packaging

LIN TSUNG SHU

Mechanisms for forming fine-pitch copper bump structures

CHEN YU-FENG

Extending metal traces in bump-on-trace structures

HUANG CHANG-CHIA

Packaging device and method of making the same

KUO CHEN-CHENG

Elongated bump structure in semiconductor device

LIN WEN-YI

Lid design for reliability enhancement in flip chip package

LIN YEN-LIANG

Elongated bumps in integrated circuit devices

CHUANG CHITA

Bump structures in semiconductor device and packaging assembly