Inventor · disambiguated record

Shih-Puu Jeng

Also filed as: JENG SHIH-PUU

1 granted patent·6 citations·filing 2006–2006

28Inventor score

Technology areasH10W

Files withHSU SHIH-HSUN1

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1 record

0169US8072076B2Bond pad structures and integrated circuit chip having the sameHSU SHIH-HSUN·Filed 2006·Granted Dec 6, 2011·6 cites·10 claims

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