Inventor

EDWARDS DAVID L

US69 patents

⚠️ This page may combine multiple inventors who share the name “EDWARDS DAVID L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EDWARDS DAVID L

IBM

Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same

Customizable lid for improved thermal performance of modules using flip chips

Apparatus for cooling of chips using a plurality of customized thermally conductive materials

Method for controlling thermal interface gap distance

Methods for customizing lid for improved thermal performance of modules using flip chips

Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Cast metal seal for semiconductor substrates

Multi-layer solder seal band for semiconductor substrates and process

Multi-layer solder seal band for semiconductor substrates

Cast metal seal for semiconductor substrates and process thereof

Underfill of chip-under-chip semiconductor modules

Multi-chip heat-sink cap assembly

Method for cooling of chips using a plurality of materials

Controlling power change for a semiconductor module to preserve thermal interface therein

Method for controlling power change for a semiconductor module

Thermal paste containment for semiconductor modules

Method and structure to improve thermal dissipation from semiconductor devices

Thermal pillow

Method and structure to improve thermal dissipation from semiconductor devices

Fluidic cooling systems and methods for electronic components

Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly

Multi-chip module and heat-sink cap combination

Method for providing a thermal path through particles embedded in a thermal cap

Thermal cap with embedded particles

Method and structure to provide balanced mechanical loading of devices in compressively loaded environments

Process and apparatus for improved module assembly using shape memory alloy springs

Process for underfilling chip-under-chip semiconductor modules

Cooling system with integrated fill and drain pump

Cooling system with integrated fill and drain pump

Cooling system with integrated fill and drain pump

Thermal paste containment for semiconductor modules

Chip package having chip extension and method

Expandable standoff connector with slit collar and related method

Liquid-cooled heat sink configured to facilitate drainage

Liquid-cooled heat sink configured to facilitate drainage

MYCOGEN CORP

Novel isolates of bacillus thuringiensis having activity against nematodes

Cellular encapsulation of biologicals for animal and human use

Pseudomas hosts transformed with bacillus endotoxin genes

Novel isolates of Bacillus thuringiensis having activity against nematodes

Hybrid diphtheria-B.t. pesticidal toxins

EDWARDS DAVID L

Target ring for an eye dropper bottle

Thermal paste containment for semiconductor modules

Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics

AVOLIX PHARMACEUTICALS INC

Cell migration inhibiting compositions and methods and compositions for treating cancer

Cell migration inhibiting compositions and methods and compositions for treating cancer

(unassigned)

Transmission service bench

CERES TECHNOLOGIES INC

Synthetic antibiotics

CAMPBELL JONATHAN W

Aerospace laser ignition/ablation variable high precision thruster

SYNOIL FLUIDS HOLDINGS INC

Mutual solvent system and method for improved oil and gas permeability in high temperature formations