Inventor
SHIRAKI HIROYUKI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “SHIRAKI HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAKEDA CHEMICAL INDUSTRIES LTD
5 patentsUS4507458AMar 26, 1985
Urethane acrylate compositions
TAKEDA CHEMICAL INDUSTRIES LTD54 citations94
US6239215B1May 29, 2001
Powder coating composition
TAKEDA CHEMICAL INDUSTRIES LTD19 citations84
US5401571AMar 28, 1995
Magnetic recording media having a binder comprising a sulfobetaine containing polyurethane resin
TAKEDA CHEMICAL INDUSTRIES LTD9 citations73
US4898922AFeb 6, 1990
Urethane resins
TAKEDA CHEMICAL INDUSTRIES LTD8 citations73
US5866657AFeb 2, 1999
Primer composition
TAKEDA CHEMICAL INDUSTRIES LTD9 citations72
MITSUBISHI MATERIAL SILICON
4 patentsUS6547875B1Apr 15, 2003
Epitaxial wafer and a method for manufacturing the same
MITSUBISHI MATERIAL SILICON18 citations81
US6693286B2Feb 17, 2004
Method for evaluating the quality of a semiconductor substrate
MITSUBISHI MATERIAL SILICON8 citations71
US6534774B2Mar 18, 2003
Method and apparatus for evaluating the quality of a semiconductor substrate
MITSUBISHI MATERIAL SILICON8 citations71
US6818197B2Nov 16, 2004
Epitaxial wafer
MITSUBISHI MATERIAL SILICON4 citations60
MITSUI TAKEDA CHEMICALS INC
3 patentsUS6569533B1May 27, 2003
Gas barrier polyurethane resin
MITSUI TAKEDA CHEMICALS INC85 citations97
US6881788B2Apr 19, 2005
Polyurethane resin water dispersion and aqueous polyurethane adhesive
MITSUI TAKEDA CHEMICALS INC4 citations54
US7026369B2Apr 11, 2006
Aqueous emulsion composition and adherent composition
MITSUI TAKEDA CHEMICALS INC0 citations50
SUMITOMO MITSUBISHI SILICON
2 patentsSUMCO CORP
2 patentsSIEMENS AG
2 patentsUS10347774B2Jul 9, 2019
Electrode provided with UBM structure having a barrier layer for reducing solder diffusion into the electrode and a method for producing the same
SIEMENS AG1 citations56
US9755098B2Sep 5, 2017
Radiation detector manufactured by dicing a semiconductor wafer and dicing method therefor
SIEMENS AG0 citations46