Inventor

CHANG TAO-CHIH

TW31 patents

⚠️ This page may combine multiple inventors who share the name “CHANG TAO-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG TAO-CHIH

IND TECH RES INST

Light-emitting device and manufacturing method of a display

Chip package structure

Signal transmission board and method for manufacturing the same

Hetero-integrated structure

Chip packaging and composite system board

Semiconductor light emitting device and fabricating method thereof

Dual-phase intermetallic interconnection structure and method of fabricating the same

Semiconductor package structure

Stacked type power device module

Package substrate and method of fabricating the same and chip package structure

Power module with housing having bending sections

Electronic device having a curved portion between a plurality of conductive portions on a substrate

Chip package module and circuit board structure comprising the same

Chip package

Chip package

Chip scale package structures

Package structure and method for connecting components

Chip scale package structures

Electronic packaging structure

Fabricating method of a semiconductor light emitting device

Solder, solder joint structure and method of forming solder joint structure

Power module for high/low voltage insulation

Chip package structure

Chip package

TSAI TSUNG-FU

Package carrier

Micro-bump structure

CHANG TAO-CHIH

Chip structure and stacked structure of chips

Electronic device package structure with a hydrophilic protection layer and method for fabricating the same

ICP TECH CO LTD

Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component

LIN YU-MIN

Bump structure and electronic packaging solder joint structure and fabricating method thereof

HUNG YIN-PO

Package unit and stacking structure thereof