P

Inventor

ANDERSON ROGER N

US59 patents
⚠️ This page may combine multiple inventors who share the name “ANDERSON ROGER N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

34 patents
US5790750AAug 4, 1998

Profiled substrate heating utilizing a support temperature and a substrate temperature

APPLIED MATERIALS INC441 citations99
US5650082AJul 22, 1997

Profiled substrate heating

APPLIED MATERIALS INC137 citations99
US5645646AJul 8, 1997

Susceptor for deposition apparatus

APPLIED MATERIALS INC406 citations99
US5551982ASep 3, 1996

Semiconductor wafer process chamber with susceptor back coating

APPLIED MATERIALS INC136 citations99
US5269847ADec 14, 1993

Variable rate distribution gas flow reaction chamber

APPLIED MATERIALS INC161 citations98
US5194401AMar 16, 1993

Thermally processing semiconductor wafers at non-ambient pressures

APPLIED MATERIALS INC580 citations98
US5179677AJan 12, 1993

Apparatus and method for substrate heating utilizing various infrared means to achieve uniform intensity

APPLIED MATERIALS INC125 citations98
US4920918AMay 1, 1990

Pressure-resistant thermal reactor system for semiconductor processing

APPLIED MATERIALS INC416 citations98
US6833322B2Dec 21, 2004

Apparatuses and methods for depositing an oxide film

APPLIED MATERIALS INC72 citations97
US5108792AApr 28, 1992

Double-dome reactor for semiconductor processing

APPLIED MATERIALS INC214 citations97
US6455814B1Sep 24, 2002

Backside heating chamber for emissivity independent thermal processes

APPLIED MATERIALS INC51 citations96
US6190113B1Feb 20, 2001

Quartz pin lift for single wafer chemical vapor deposition/etch process chamber

APPLIED MATERIALS INC412 citations96
US6113703ASep 5, 2000

Method and apparatus for processing the upper and lower faces of a wafer

APPLIED MATERIALS INC367 citations96
US6108491AAug 22, 2000

Dual surface reflector

APPLIED MATERIALS INC54 citations96
US6099648AAug 8, 2000

Domed wafer reactor vessel window with reduced stress at atmospheric and above atmospheric pressures

APPLIED MATERIALS INC42 citations96
US5916369AJun 29, 1999

Gas inlets for wafer processing chamber

APPLIED MATERIALS INC117 citations96
US5599397AFeb 4, 1997

Semiconductor wafer process chamber with suspector back coating

APPLIED MATERIALS INC43 citations96
US6476362B1Nov 5, 2002

Lamp array for thermal processing chamber

APPLIED MATERIALS INC63 citations95
US5085887AFeb 4, 1992

Wafer reactor vessel window with pressure-thermal compensation

APPLIED MATERIALS INC86 citations95
US5044943ASep 3, 1991

Spoked susceptor support for enhanced thermal uniformity of susceptor in semiconductor wafer processing apparatus

APPLIED MATERIALS INC114 citations95
US6064799AMay 16, 2000

Method and apparatus for controlling the radial temperature gradient of a wafer while ramping the wafer temperature

APPLIED MATERIALS INC46 citations93
US5573334ANov 12, 1996

Method for the turbulent mixing of gases

APPLIED MATERIALS INC33 citations93
US5523063AJun 4, 1996

Apparatus for the turbulent mixing of gases

APPLIED MATERIALS INC30 citations93
US6083323AJul 4, 2000

Method for controlling the temperature of the walls of a reaction chamber during processing

APPLIED MATERIALS INC34 citations92
US5855677AJan 5, 1999

Method and apparatus for controlling the temperature of reaction chamber walls

APPLIED MATERIALS INC37 citations92
US5834059ANov 10, 1998

Process of depositing a layer of material on a wafer with susceptor back coating

APPLIED MATERIALS INC29 citations92
US5455070AOct 3, 1995

Variable rate distribution gas flow reaction chamber

APPLIED MATERIALS INC41 citations92
US6500734B2Dec 31, 2002

Gas inlets for wafer processing chamber

APPLIED MATERIALS INC45 citations91
US5809211ASep 15, 1998

Ramping susceptor-wafer temperature using a single temperature input

APPLIED MATERIALS INC45 citations90
US6399510B1Jun 4, 2002

Bi-directional processing chamber and method for bi-directional processing of semiconductor substrates

APPLIED MATERIALS INC48 citations89
US8372203B2Feb 12, 2013

Apparatus temperature control and pattern compensation

APPLIED MATERIALS INC9 citations83
US7691204B2Apr 6, 2010

Film formation apparatus and methods including temperature and emissivity/pattern compensation

APPLIED MATERIALS INC13 citations83
US5725673AMar 10, 1998

Semiconductor wafer process chamber with susceptor back coating

APPLIED MATERIALS INC14 citations82
US6406543B1Jun 18, 2002

Infra-red transparent thermal reactor cover member

APPLIED MATERIALS INC8 citations74

UNIV COLUMBIA

10 patents

ANDERSON ROGER N

2 patents

US AIR FORCE

1 patent

AKW ANALYTICS INC

1 patent

TRUSTESS OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK

1 patent

CHOW MAGGIE

1 patent

Showing the top 50 of 59 patents by PatentIndex Score.