Inventor

LIN CHUN-HUNG

TW217 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHUN-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHUN-HUNG

ADVANCED SEMICONDUCTOR ENG

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package having concave die pad and/or connections pads

Multichip module having stacked chip arrangement

Multichip module having a stacked chip arrangement

Multichip module having a stacked chip arrangement

Molding method for BGA semiconductor chip package

Multichip module having a stacked chip arrangement

Method of molding semiconductor device and molding die for use therein

Semiconductor package with wire protection and method therefor

Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking

Method of making semiconductor packages at wafer level

Method of making chip scale package

Solder paste for fabricating bump

Semiconductor chip package and manufacturing method thereof

Wafer-dicing process

Ball grid array semiconductor package with improved strength and electric performance and method for making the same

Semiconductor packages and related manufacturing methods

IND TECH RES INST

Diaphragm valve

Electropolishing process means for an inner surface of a long tube

Electropolish/grinding means for an inner surface of a long tube

Non-contact pick-up device

ANTEYA TECHNOLOGY CORP

LED lamp

Lighting device having LED light bars

LED lamp

TAIWAN MICROLOOPS CORP

Liquid-vapor separating type heat conductive structure

Vapor chamber structure

Vapor chamber and heat pipe combined structure

MACRONIX INT CO LTD

Method and system for managing a flash memory mass storage system

Flash memory mass storage system

ACADEMIA SINICA

Immuno-modulating antitumor activities of ganoderma lucidum (reishi) polysaccharides

Immuno-modulating antitumor activities of Ganoderma lucidum (Reishi) polysaccharides

TAIWAN SEMICONDUCTOR MFG CO LTD

Bumps for chip scale packaging including under bump metal structures with different diameters

Packages with stress-reducing structures and methods of forming same

SUNPLUS TECHNOLOGY CO LTD

Method and system for adaptive motion estimation

Method for detecting sub-pixel motion for optical navigation device

EMEMORY TECHNOLOGY INC

Random code generator with differential cells and associated control method

One time programming non-volatile memory cell

(unassigned)

Method and apparatus for molding a flip chip semiconductor device

SCRIPPS RESEARCH INST

One-pot enzymatic sulfation process using 3&#39;-phosphoadenosine-5&#39;-phosphosulfate and recycled phosphorylated adenosine intermediates

CYBERLINK CORP

Method and system of automatically extracting facial features

LIN CHUN HUNG

TPMS tool

COOLER MASTER TECH INC

Liquid cooling device having diversion mechanism

COOLER MASTER CO LTD

Electronic device and liquid cooling heat dissipation structure thereof

LIN CHUN-HUNG

Stress compensation layer for 3D packaging

TAIWAN SEMICONDUCTOR MFG

Methods and apparatus for package with interposers

HON HAI PREC IND CO LTD

Lens module and digital camera module using same

CHEN YU-FENG

Crack stopper on under-bump metallization layer

CHIPMOS TECHNOLOGIES BERMUDA

High frequency IC package and method for fabricating the same

PENG JUI-CHUNG

System and method for improving immersion scanner overlay performance

COMPAL ELECTRONICS INC

Method for controlling fan speed

One-pot enzymatic sulfation process using 3'-phosphoadenosine-5'-phosphosulfate and recycled phosphorylated adenosine intermediates