Inventor
CHOPIN SHEILA F
US16 patents
⚠️ This page may combine multiple inventors who share the name “CHOPIN SHEILA F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
8 patentsUS6998952B2Feb 14, 2006
Inductive device including bond wires
FREESCALE SEMICONDUCTOR INC137 citations97
US9093383B1Jul 28, 2015
Encapsulant for a semiconductor device
FREESCALE SEMICONDUCTOR INC7 citations84
US7215014B2May 8, 2007
Solderable metal finish for integrated circuit package leads and method for forming
FREESCALE SEMICONDUCTOR INC16 citations82
US8853867B2Oct 7, 2014
Encapsulant for a semiconductor device
FREESCALE SEMICONDUCTOR INC6 citations73
US7172927B2Feb 6, 2007
Warpage control of array packaging
FREESCALE SEMICONDUCTOR INC8 citations73
US7015585B2Mar 21, 2006
Packaged integrated circuit having wire bonds and method therefor
FREESCALE SEMICONDUCTOR INC2 citations61
US10199339B2Feb 5, 2019
Semiconductor structure with sacrificial anode and method for forming
FREESCALE SEMICONDUCTOR INC0 citations52
US7803662B2Sep 28, 2010
Warpage control using a package carrier assembly
FREESCALE SEMICONDUCTOR INC0 citations51
CHOPIN SHEILA F
3 patentsUS8836110B2Sep 16, 2014
Heat spreader for use within a packaged semiconductor device
CHOPIN SHEILA F13 citations81
US9412709B2Aug 9, 2016
Semiconductor structure with sacrificial anode and passivation layer and method for forming
CHOPIN SHEILA F0 citations50
US9426884B2Aug 23, 2016
System and method for lead frame package degating
CHOPIN SHEILA F0 citations49
NXP USA INC
3 patentsUS12415305B2Sep 16, 2025
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
NXP USA INC0 citations61
US11787097B2Oct 17, 2023
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
NXP USA INC0 citations61
US10217713B2Feb 26, 2019
Semiconductor device attached to an exposed pad
NXP USA INC0 citations40