Inventor
SHIN HEON-JONG
KR57 patents
⚠️ This page may combine multiple inventors who share the name “SHIN HEON-JONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
45 patentsUS6207519B1Mar 27, 2001
Method of making semiconductor device having double spacer
SAMSUNG ELECTRONICS CO LTD48 citations96
US5929483AJul 27, 1999
Semiconductor device having spacer and method of making same
SAMSUNG ELECTRONICS CO LTD52 citations96
US6384464B1May 7, 2002
Integrated circuit device including dummy patterns surrounding pads
SAMSUNG ELECTRONICS CO LTD46 citations93
US6274906B1Aug 14, 2001
MOS transistor for high-speed and high-performance operation and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD20 citations93
US5863833AJan 26, 1999
Method for forming side contact in a semiconductor device
SAMSUNG ELECTRONICS CO LTD27 citations93
US5821590AOct 13, 1998
Semiconductor interconnection device with both n- and p-doped regions
SAMSUNG ELECTRONICS CO LTD42 citations93
US6846710B2Jan 25, 2005
Method for manufacturing self-aligned BiCMOS
SAMSUNG ELECTRONICS CO LTD38 citations91
US6552438B2Apr 22, 2003
Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same
SAMSUNG ELECTRONICS CO LTD34 citations88
US7768128B2Aug 3, 2010
Semiconductor memory devices including a damascene wiring line
SAMSUNG ELECTRONICS CO LTD12 citations84
US7211515B2May 1, 2007
Methods of forming silicide layers on source/drain regions of MOS transistors
SAMSUNG ELECTRONICS CO LTD16 citations84
US7008841B2Mar 7, 2006
Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD18 citations84
US6218715B1Apr 17, 2001
MOS transistor for high-speed operation
SAMSUNG ELECTRONICS CO LTD17 citations84
US7781282B2Aug 24, 2010
Shared contact structure, semiconductor device and method of fabricating the semiconductor device
SAMSUNG ELECTRONICS CO LTD13 citations83
US10340219B2Jul 2, 2019
Semiconductor device having a metal via
SAMSUNG ELECTRONICS CO LTD7 citations82
US7550822B2Jun 23, 2009
Dual-damascene metal wiring patterns for integrated circuit devices
SAMSUNG ELECTRONICS CO LTD13 citations82
US6479337B2Nov 12, 2002
Semiconductor device including a charge-dispersing region and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD5 citations74
US6344380B1Feb 5, 2002
Manufacturing of gate electrodes having silicon of different grain sizes and different surface roughness
SAMSUNG ELECTRONICS CO LTD7 citations74
US6245624B1Jun 12, 2001
Methods of fabricating field effect transistors by first forming heavily doped source/drain regions and then forming lightly doped source/drain regions
SAMSUNG ELECTRONICS CO LTD7 citations74
US6136701AOct 24, 2000
Contact structure for semiconductor device and the manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD10 citations74
US10643898B2May 5, 2020
Semiconductor devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US5742078AApr 21, 1998
Integrated circuit SRAM cell layouts
SAMSUNG ELECTRONICS CO LTD12 citations73
US11769769B2Sep 26, 2023
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11316010B2Apr 26, 2022
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10763256B2Sep 1, 2020
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10665588B2May 26, 2020
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US10553484B2Feb 4, 2020
Semiconductor devices including contact plugs
SAMSUNG ELECTRONICS CO LTD3 citations71
US6639282B2Oct 28, 2003
Semiconductor device on silicon-on-insulator and method for manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD8 citations71
US7863152B2Jan 4, 2011
Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure
SAMSUNG ELECTRONICS CO LTD6 citations70
US7122850B2Oct 17, 2006
Semiconductor device having local interconnection layer and etch stopper pattern for preventing leakage of current
SAMSUNG ELECTRONICS CO LTD5 citations69
US6127707AOct 3, 2000
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations67
US8013455B2Sep 6, 2011
Semiconductor device having pads
SAMSUNG ELECTRONICS CO LTD4 citations63
US6461924B2Oct 8, 2002
MOS transistor for high-speed and high-performance operation and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD2 citations63
US6329697B1Dec 11, 2001
Semiconductor device including a charge-dispersing region and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD4 citations63
US5837602ANov 17, 1998
Method of manufacturing doped interconnect
SAMSUNG ELECTRONICS CO LTD2 citations63
US12457797B2Oct 28, 2025
Semiconductor devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11876019B2Jan 16, 2024
Semiconductor devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11201086B2Dec 14, 2021
Semiconductor devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
USRE36440EDec 14, 1999
Integrated circuit SRAM cell layouts
SAMSUNG ELECTRONICS CO LTD6 citations62
US11721581B2Aug 8, 2023
Semiconductor devices including contact plugs
SAMSUNG ELECTRONICS CO LTD0 citations61
US6943084B2Sep 13, 2005
Semiconductor device on silicon-on-insulator and method for manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations60
US5717253AFeb 10, 1998
Structure for forming an improved quality silicidation layer
SAMSUNG ELECTRONICS CO LTD6 citations60
US12426227B2Sep 23, 2025
Method of manufacturing a semiconductor device having a node capping pattern and a gate capping pattern
SAMSUNG ELECTRONICS CO LTD0 citations59
US11778801B2Oct 3, 2023
Semiconductor device having a node capping pattern and a gate capping pattern
SAMSUNG ELECTRONICS CO LTD0 citations59
US8350354B2Jan 8, 2013
Semiconductor device structure with strain layer
SAMSUNG ELECTRONICS CO LTD4 citations59
US10319858B2Jun 11, 2019
Semiconductor devices having lower and upper fins and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
KIM SUNG MIN
2 patentsJUN HWI-CHAN
2 patentsYOO ABRAHAM
1 patentShowing the top 50 of 57 patents by PatentIndex Score.