P

Inventor

SHIN HEON-JONG

KR57 patents
⚠️ This page may combine multiple inventors who share the name “SHIN HEON-JONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

45 patents
US6207519B1Mar 27, 2001

Method of making semiconductor device having double spacer

SAMSUNG ELECTRONICS CO LTD48 citations96
US5929483AJul 27, 1999

Semiconductor device having spacer and method of making same

SAMSUNG ELECTRONICS CO LTD52 citations96
US6384464B1May 7, 2002

Integrated circuit device including dummy patterns surrounding pads

SAMSUNG ELECTRONICS CO LTD46 citations93
US6274906B1Aug 14, 2001

MOS transistor for high-speed and high-performance operation and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD20 citations93
US5863833AJan 26, 1999

Method for forming side contact in a semiconductor device

SAMSUNG ELECTRONICS CO LTD27 citations93
US5821590AOct 13, 1998

Semiconductor interconnection device with both n- and p-doped regions

SAMSUNG ELECTRONICS CO LTD42 citations93
US6846710B2Jan 25, 2005

Method for manufacturing self-aligned BiCMOS

SAMSUNG ELECTRONICS CO LTD38 citations91
US6552438B2Apr 22, 2003

Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same

SAMSUNG ELECTRONICS CO LTD34 citations88
US7768128B2Aug 3, 2010

Semiconductor memory devices including a damascene wiring line

SAMSUNG ELECTRONICS CO LTD12 citations84
US7211515B2May 1, 2007

Methods of forming silicide layers on source/drain regions of MOS transistors

SAMSUNG ELECTRONICS CO LTD16 citations84
US7008841B2Mar 7, 2006

Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD18 citations84
US6218715B1Apr 17, 2001

MOS transistor for high-speed operation

SAMSUNG ELECTRONICS CO LTD17 citations84
US7781282B2Aug 24, 2010

Shared contact structure, semiconductor device and method of fabricating the semiconductor device

SAMSUNG ELECTRONICS CO LTD13 citations83
US10340219B2Jul 2, 2019

Semiconductor device having a metal via

SAMSUNG ELECTRONICS CO LTD7 citations82
US7550822B2Jun 23, 2009

Dual-damascene metal wiring patterns for integrated circuit devices

SAMSUNG ELECTRONICS CO LTD13 citations82
US6479337B2Nov 12, 2002

Semiconductor device including a charge-dispersing region and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD5 citations74
US6344380B1Feb 5, 2002

Manufacturing of gate electrodes having silicon of different grain sizes and different surface roughness

SAMSUNG ELECTRONICS CO LTD7 citations74
US6245624B1Jun 12, 2001

Methods of fabricating field effect transistors by first forming heavily doped source/drain regions and then forming lightly doped source/drain regions

SAMSUNG ELECTRONICS CO LTD7 citations74
US6136701AOct 24, 2000

Contact structure for semiconductor device and the manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD10 citations74
US10643898B2May 5, 2020

Semiconductor devices and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations73
US5742078AApr 21, 1998

Integrated circuit SRAM cell layouts

SAMSUNG ELECTRONICS CO LTD12 citations73
US11769769B2Sep 26, 2023

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US11316010B2Apr 26, 2022

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US10763256B2Sep 1, 2020

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US10665588B2May 26, 2020

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations71
US10553484B2Feb 4, 2020

Semiconductor devices including contact plugs

SAMSUNG ELECTRONICS CO LTD3 citations71
US6639282B2Oct 28, 2003

Semiconductor device on silicon-on-insulator and method for manufacturing the semiconductor device

SAMSUNG ELECTRONICS CO LTD8 citations71
US7863152B2Jan 4, 2011

Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure

SAMSUNG ELECTRONICS CO LTD6 citations70
US7122850B2Oct 17, 2006

Semiconductor device having local interconnection layer and etch stopper pattern for preventing leakage of current

SAMSUNG ELECTRONICS CO LTD5 citations69
US6127707AOct 3, 2000

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations67
US8013455B2Sep 6, 2011

Semiconductor device having pads

SAMSUNG ELECTRONICS CO LTD4 citations63
US6461924B2Oct 8, 2002

MOS transistor for high-speed and high-performance operation and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD2 citations63
US6329697B1Dec 11, 2001

Semiconductor device including a charge-dispersing region and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD4 citations63
US5837602ANov 17, 1998

Method of manufacturing doped interconnect

SAMSUNG ELECTRONICS CO LTD2 citations63
US12457797B2Oct 28, 2025

Semiconductor devices and methods of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11876019B2Jan 16, 2024

Semiconductor devices and methods of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11201086B2Dec 14, 2021

Semiconductor devices and methods of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations62
USRE36440EDec 14, 1999

Integrated circuit SRAM cell layouts

SAMSUNG ELECTRONICS CO LTD6 citations62
US11721581B2Aug 8, 2023

Semiconductor devices including contact plugs

SAMSUNG ELECTRONICS CO LTD0 citations61
US6943084B2Sep 13, 2005

Semiconductor device on silicon-on-insulator and method for manufacturing the semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations60
US5717253AFeb 10, 1998

Structure for forming an improved quality silicidation layer

SAMSUNG ELECTRONICS CO LTD6 citations60
US12426227B2Sep 23, 2025

Method of manufacturing a semiconductor device having a node capping pattern and a gate capping pattern

SAMSUNG ELECTRONICS CO LTD0 citations59
US11778801B2Oct 3, 2023

Semiconductor device having a node capping pattern and a gate capping pattern

SAMSUNG ELECTRONICS CO LTD0 citations59
US8350354B2Jan 8, 2013

Semiconductor device structure with strain layer

SAMSUNG ELECTRONICS CO LTD4 citations59
US10319858B2Jun 11, 2019

Semiconductor devices having lower and upper fins and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations52

KIM SUNG MIN

2 patents

JUN HWI-CHAN

2 patents

YOO ABRAHAM

1 patent

Showing the top 50 of 57 patents by PatentIndex Score.