Inventor
SEARLS DAMION T
US33 patents
Patents
33 patentsUS6550531B1Apr 22, 2003
Vapor chamber active heat sink
INTEL CORP106 citations97
US6327145B1Dec 4, 2001
Heat sink with integrated fluid circulation pump
INTEL CORP100 citations97
US6856016B2Feb 15, 2005
Method and apparatus using nanotubes for cooling and grounding die
INTEL CORP94 citations96
US6713871B2Mar 30, 2004
Surface mount solder method and apparatus for decoupling capacitance and process of making
INTEL CORP45 citations94
US7316265B2Jan 8, 2008
Method for passive phase change thermal management
INTEL CORP18 citations92
US7158111B1Jan 2, 2007
Flexible display
INTEL CORP23 citations92
US6730860B2May 4, 2004
Electronic assembly and a method of constructing an electronic assembly
INTEL CORP23 citations92
US6672370B2Jan 6, 2004
Apparatus and method for passive phase change thermal management
INTEL CORP26 citations92
US6486589B1Nov 26, 2002
Circuit card assembly having controlled vibrational properties
INTEL CORP33 citations92
US7122891B2Oct 17, 2006
Ceramic embedded wireless antenna
INTEL CORP32 citations91
US6752635B1Jun 22, 2004
Comb-shaped land grid array (LGA) socket contact for improved power delivery
INTEL CORP21 citations91
US6731221B1May 4, 2004
Electrically modifiable product labeling
INTEL CORP34 citations89
US6580608B1Jun 17, 2003
Method and apparatus for thermally controlling multiple electronic components
INTEL CORP35 citations89
US7886809B2Feb 15, 2011
Apparatus and method for passive phase change thermal management
INTEL CORP9 citations84
US6649937B2Nov 18, 2003
Semiconductor device with components embedded in backside diamond layer
INTEL CORP14 citations83
US6614657B2Sep 2, 2003
Heat sink for cooling an electronic component of a computer
INTEL CORP12 citations74
US6793505B2Sep 21, 2004
Ganged land grid array socket contacts for improved power delivery
INTEL CORP11 citations73
US6774310B1Aug 10, 2004
Surface mount connector lead
INTEL CORP9 citations73
US6359372B1Mar 19, 2002
Circuit card assembly having controlled expansion properties
INTEL CORP9 citations73
US7135758B2Nov 14, 2006
Surface mount solder method and apparatus for decoupling capacitance and process of making
INTEL CORP5 citations72
US6627822B2Sep 30, 2003
Electronic assembly with separate power and signal connections
INTEL CORP10 citations72
US6996899B2Feb 14, 2006
Electronic assembly and a method of constructing an electronic assembly
INTEL CORP4 citations63
US6913999B2Jul 5, 2005
Semiconductor device with components embedded in backside diamond layer
INTEL CORP4 citations62
US7495318B2Feb 24, 2009
Apparatus and method for improving AC coupling on circuit boards
INTEL CORP2 citations61
US6905979B2Jun 14, 2005
Apparatus and method for improving AC coupling on circuit boards
INTEL CORP3 citations61
US7538440B2May 26, 2009
Method for improved high current component interconnections
INTEL CORP3 citations58
US9478488B2Oct 25, 2016
Reducing loadline impedance in a system
INTEL CORP0 citations52
US7791585B2Sep 7, 2010
Method of fabricating flexible display
INTEL CORP0 citations52
US7638884B2Dec 29, 2009
Thin semiconductor device package
INTEL CORP0 citations52
US7517732B2Apr 14, 2009
Thin semiconductor device package
INTEL CORP1 citations52
US6793503B2Sep 21, 2004
Ganged land grid array socket contacts for improved power delivery
INTEL CORP0 citations51
US7255492B2Aug 14, 2007
Electro-optic surface mount light pipe and connector
INTEL CORP0 citations50
US6624643B2Sep 23, 2003
Apparatus and method to read output information from a backside of a silicon device
INTEL CORP0 citations42