Reducing loadline impedance in a system

Abstract

In one embodiment, the present invention includes a semiconductor device mounted to a first side of a circuit board; and at least one voltage regulator device mounted to a second side of the circuit board, the second side opposite to the first side. Examples of the voltage regulator devices include output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

What is claimed is: 
     
       1. A semiconductor device comprising:
 a package wherein the package is coupled via a socket to a primary side of a circuit board, the circuit board having a plurality of voltage regulator components on a secondary side of the circuit board; and 
 a plurality of interconnects forming an interconnect field coupled to the package, the plurality of interconnects comprising:
 a first set of interconnects located at an interior portion of the interconnect field to connect to a first voltage; 
 a second set of interconnects located substantially around the first set of interconnects to connect to a second voltage; and 
 
 inductor pads to enable at least one inductor to be coupled to the secondary side of the circuit board and between a pulse width modulation plane and a supply plane of the circuit board. 
 
     
     
       2. The semiconductor device of  claim 1 , wherein the first set of interconnects and the second set of interconnects abut with a substantially crenellated pattern. 
     
     
       3. The semiconductor device of  claim 1 , wherein the first voltage comprises a power supply voltage and the second voltage comprises a reference voltage. 
     
     
       4. The semiconductor device of  claim 1 , wherein the plurality of voltage regulator components comprise output filters located substantially underneath the socket.