Inventor
WANG SUNG-FEI
TW15 patents
Patents
15 patentsUS6861761B2Mar 1, 2005
Multi-chip stack flip-chip package
ADVANCED SEMICONDUCTOR ENG74 citations96
US6365966B1Apr 2, 2002
Stacked chip scale package
ADVANCED SEMICONDUCTOR ENG66 citations95
US7268418B2Sep 11, 2007
Multi-chips stacked package
ADVANCED SEMICONDUCTOR ENG36 citations92
US7026719B2Apr 11, 2006
Semiconductor package with a heat spreader
ADVANCED SEMICONDUCTOR ENG26 citations92
US7015577B2Mar 21, 2006
Flip chip package capable of measuring bond line thickness of thermal interface material
ADVANCED SEMICONDUCTOR ENG39 citations92
US6936930B2Aug 30, 2005
Thermal enhance MCM package
ADVANCED SEMICONDUCTOR ENG34 citations92
US6879031B2Apr 12, 2005
Multi-chips package
ADVANCED SEMICONDUCTOR ENG24 citations92
US6161753ADec 19, 2000
Method of making a low-profile wire connection for stacked dies
ADVANCED SEMICONDUCTOR ENG28 citations92
US7291924B2Nov 6, 2007
Flip chip stacked package
ADVANCED SEMICONDUCTOR ENG23 citations91
US7215016B2May 8, 2007
Multi-chips stacked package
ADVANCED SEMICONDUCTOR ENG15 citations83
US7025848B2Apr 11, 2006
Heat sink for chip package and bonding method thereof
ADVANCED SEMICONDUCTOR ENG13 citations83
US7023079B2Apr 4, 2006
Stacked semiconductor chip package
ADVANCED SEMICONDUCTOR ENG12 citations83
US7473989B2Jan 6, 2009
Flip-chip package
ADVANCED SEMICONDUCTOR ENG9 citations82
US7002255B2Feb 21, 2006
Multi-chips stacked package
ADVANCED SEMICONDUCTOR ENG5 citations62
US6949826B2Sep 27, 2005
High density semiconductor package
ADVANCED SEMICONDUCTOR ENG4 citations62