Inventor
FUKUYO FUMITSUGU
JP68 patents
⚠️ This page may combine multiple inventors who share the name “FUKUYO FUMITSUGU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HAMAMATSU PHOTONICS KK
23 patentsUS7825350B2Nov 2, 2010
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK126 citations99
US7749867B2Jul 6, 2010
Method of cutting processed object
HAMAMATSU PHOTONICS KK130 citations99
US7732730B2Jun 8, 2010
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK139 citations99
US7626137B2Dec 1, 2009
Laser cutting by forming a modified region within an object and generating fractures
HAMAMATSU PHOTONICS KK130 citations99
US7615721B2Nov 10, 2009
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK118 citations99
US7592238B2Sep 22, 2009
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK123 citations99
US7566635B2Jul 28, 2009
Substrate dividing method
HAMAMATSU PHOTONICS KK172 citations99
US7547613B2Jun 16, 2009
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK144 citations99
US7396742B2Jul 8, 2008
Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object
HAMAMATSU PHOTONICS KK167 citations99
US6992026B2Jan 31, 2006
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK447 citations99
US7489454B2Feb 10, 2009
Laser processing device
HAMAMATSU PHOTONICS KK117 citations97
US9837315B2Dec 5, 2017
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK8 citations93
US9543207B2Jan 10, 2017
Substrate dividing method
HAMAMATSU PHOTONICS KK6 citations93
US8673745B2Mar 18, 2014
Method of cutting object to be processed
HAMAMATSU PHOTONICS KK9 citations93
US10796959B2Oct 6, 2020
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK3 citations84
US10068801B2Sep 4, 2018
Substrate dividing method
HAMAMATSU PHOTONICS KK4 citations84
US9553023B2Jan 24, 2017
Substrate dividing method
HAMAMATSU PHOTONICS KK3 citations84
US9548246B2Jan 17, 2017
Substrate dividing method
HAMAMATSU PHOTONICS KK4 citations84
US9543256B2Jan 10, 2017
Substrate dividing method
HAMAMATSU PHOTONICS KK2 citations84
US8361883B2Jan 29, 2013
Laser processing method
HAMAMATSU PHOTONICS KK8 citations84
US11424162B2Aug 23, 2022
Substrate dividing method
HAMAMATSU PHOTONICS KK1 citations73
US9240313B2Jan 19, 2016
Target for ultraviolet light generation, electron beam-excited ultraviolet light source, and production method for target for ultraviolet light generation
HAMAMATSU PHOTONICS KK3 citations72
US10622255B2Apr 14, 2020
Substrate dividing method
HAMAMATSU PHOTONICS KK0 citations63
FUKUYO FUMITSUGU
16 patentsUS8283595B2Oct 9, 2012
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU68 citations99
US8685838B2Apr 1, 2014
Laser beam machining method
FUKUYO FUMITSUGU93 citations98
US8263479B2Sep 11, 2012
Method for cutting semiconductor substrate
FUKUYO FUMITSUGU44 citations98
US8227724B2Jul 24, 2012
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU31 citations96
US8183131B2May 22, 2012
Method of cutting an object to be processed
FUKUYO FUMITSUGU27 citations96
US8969761B2Mar 3, 2015
Method of cutting a wafer-like object and semiconductor chip
FUKUYO FUMITSUGU10 citations93
US8927900B2Jan 6, 2015
Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
FUKUYO FUMITSUGU14 citations93
US8551865B2Oct 8, 2013
Method of cutting an object to be processed
FUKUYO FUMITSUGU10 citations93
US8247734B2Aug 21, 2012
Laser beam machining method
FUKUYO FUMITSUGU29 citations92
US8450187B2May 28, 2013
Method of cutting semiconductor substrate
FUKUYO FUMITSUGU6 citations84
US8946591B2Feb 3, 2015
Method of manufacturing a semiconductor device formed using a substrate cutting method
FUKUYO FUMITSUGU3 citations74
US8946592B2Feb 3, 2015
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU3 citations74
US8716110B2May 6, 2014
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU3 citations74
US8598015B2Dec 3, 2013
Laser processing method
FUKUYO FUMITSUGU3 citations74
US8890027B2Nov 18, 2014
Laser processing method and laser processing system
FUKUYO FUMITSUGU4 citations70
US9488827B2Nov 8, 2016
Spectral device
FUKUYO FUMITSUGU6 citations67
FUJII YOSHIMARO
6 patentsUS8314013B2Nov 20, 2012
Semiconductor chip manufacturing method
FUJII YOSHIMARO23 citations96
US8304325B2Nov 6, 2012
Substrate dividing method
FUJII YOSHIMARO25 citations96
US8268704B2Sep 18, 2012
Method for dicing substrate
FUJII YOSHIMARO25 citations96
US8518801B2Aug 27, 2013
Substrate dividing method
FUJII YOSHIMARO8 citations92
US8518800B2Aug 27, 2013
Substrate dividing method
FUJII YOSHIMARO13 citations92
US8519511B2Aug 27, 2013
Substrate dividing method
FUJII YOSHIMARO10 citations92
FUKUMITSU KENSHI
3 patentsATSUMI KAZUHIRO
1 patentHONDA YOSHINORI
1 patentShowing the top 50 of 68 patents by PatentIndex Score.