Inventor
LIAO SIH-HAO
TW88 patents
Patents
50 patentsUS11289396B2Mar 29, 2022
Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations93
US11454888B2Sep 27, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US12087654B2Sep 10, 2024
Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations85
US11764124B2Sep 19, 2023
Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations85
US11456280B2Sep 27, 2022
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11114407B2Sep 7, 2021
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10833053B1Nov 10, 2020
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10658199B2May 19, 2020
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10510704B2Dec 17, 2019
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10276543B1Apr 30, 2019
Semicondcutor device package and method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US11004796B2May 11, 2021
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US12538808B2Jan 27, 2026
Die and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations75
US11798857B2Oct 24, 2023
Composition for sacrificial film, package, manufacturing method of package
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12218009B2Feb 4, 2025
Semiconductor package and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations74
US11894336B2Feb 6, 2024
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11694967B2Jul 4, 2023
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations74
US12009331B2Jun 11, 2024
Integrated circuit packages having adhesion layers for through vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11961777B2Apr 16, 2024
Package structure comprising buffer layer for reducing thermal stress and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11892774B2Feb 6, 2024
Lithography
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11868047B2Jan 9, 2024
Polymer layer in semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11791313B2Oct 17, 2023
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11532531B2Dec 20, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11417582B2Aug 16, 2022
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11404342B2Aug 2, 2022
Package structure comprising buffer layer for reducing thermal stress and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11276647B2Mar 15, 2022
Method of forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11270927B2Mar 8, 2022
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11201079B2Dec 14, 2021
Wafer chuck
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11164839B2Nov 2, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11031289B2Jun 8, 2021
Semiconductor package and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10978405B1Apr 13, 2021
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10332856B2Jun 25, 2019
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276421B2Apr 30, 2019
Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9741586B2Aug 22, 2017
Method of fabricating package structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12165966B2Dec 10, 2024
Package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11854927B2Dec 26, 2023
Semiconductor package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12519024B2Jan 6, 2026
Package structure comprising buffer layer for reducing thermal stress and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12469759B2Nov 11, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12400876B2Aug 26, 2025
Methods of manufacture having redistribution layer using dielectric material photoactive component
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12334433B2Jun 17, 2025
Semiconductor device and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12265330B2Apr 1, 2025
Polymer material in a redistribution structure of a semiconductor package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12191222B2Jan 7, 2025
Integrated fan out device with a filler-free insulating material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12147159B2Nov 19, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12119235B2Oct 15, 2024
Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11948904B2Apr 2, 2024
Die and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11728181B2Aug 15, 2023
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11721603B2Aug 8, 2023
Integrated fan out method utilizing a filler-free insulating material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11450603B2Sep 20, 2022
Semiconductor device and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11342296B2May 24, 2022
Semiconductor structure, semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11282804B2Mar 22, 2022
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10658208B2May 19, 2020
Polyimide composition for package structure, package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
Showing the top 50 of 88 patents by PatentIndex Score.