P

Inventor

HUANG CHIEN-CHAO

TW61 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIEN-CHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

33 patents
US7238564B2Jul 3, 2007

Method of forming a shallow trench isolation structure

TAIWAN SEMICONDUCTOR MFG64 citations98
US7190036B2Mar 13, 2007

Transistor mobility improvement by adjusting stress in shallow trench isolation

TAIWAN SEMICONDUCTOR MFG68 citations98
US7183137B2Feb 27, 2007

Method for dicing semiconductor wafers

TAIWAN SEMICONDUCTOR MFG102 citations98
US6867433B2Mar 15, 2005

Semiconductor-on-insulator chip incorporating strained-channel partially-depleted, fully-depleted, and multiple-gate transistors

TAIWAN SEMICONDUCTOR MFG321 citations98
US7268024B2Sep 11, 2007

Semiconductor-on-insulator chip incorporating strained-channel partially-depleted, fully-depleted, and multiple-gate transistors

TAIWAN SEMICONDUCTOR MFG80 citations97
US6900502B2May 31, 2005

Strained channel on insulator device

TAIWAN SEMICONDUCTOR MFG120 citations97
US7022561B2Apr 4, 2006

CMOS device

TAIWAN SEMICONDUCTOR MFG84 citations95
US7504652B2Mar 17, 2009

Phase change random access memory

TAIWAN SEMICONDUCTOR MFG21 citations93
US6812116B2Nov 2, 2004

Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance

TAIWAN SEMICONDUCTOR MFG22 citations93
US7135372B2Nov 14, 2006

Strained silicon device manufacturing method

TAIWAN SEMICONDUCTOR MFG18 citations92
US7053453B2May 30, 2006

Substrate contact and method of forming the same

TAIWAN SEMICONDUCTOR MFG34 citations92
US6924181B2Aug 2, 2005

Strained silicon layer semiconductor product employing strained insulator layer

TAIWAN SEMICONDUCTOR MFG38 citations92
US6878610B1Apr 12, 2005

Relaxed silicon germanium substrate with low defect density

TAIWAN SEMICONDUCTOR MFG29 citations92
US7164189B2Jan 16, 2007

Slim spacer device and manufacturing method

TAIWAN SEMICONDUCTOR MFG21 citations91
US8008157B2Aug 30, 2011

CMOS device with raised source and drain regions

TAIWAN SEMICONDUCTOR MFG8 citations84
US7545006B2Jun 9, 2009

CMOS devices with graded silicide regions

TAIWAN SEMICONDUCTOR MFG10 citations84
US7465620B2Dec 16, 2008

Transistor mobility improvement by adjusting stress in shallow trench isolation

TAIWAN SEMICONDUCTOR MFG13 citations84
US7357838B2Apr 15, 2008

Relaxed silicon germanium substrate with low defect density

TAIWAN SEMICONDUCTOR MFG13 citations84
US7342289B2Mar 11, 2008

Strained silicon MOS devices

TAIWAN SEMICONDUCTOR MFG13 citations84
US7119440B2Oct 10, 2006

Back end IC wiring with improved electro-migration resistance

TAIWAN SEMICONDUCTOR MFG11 citations84
US7029994B2Apr 18, 2006

Strained channel on insulator device

TAIWAN SEMICONDUCTOR MFG15 citations84
US7265425B2Sep 4, 2007

Semiconductor device employing an extension spacer and a method of forming the same

TAIWAN SEMICONDUCTOR MFG12 citations82
US6975006B2Dec 13, 2005

Semiconductor device with modified channel compressive stress

TAIWAN SEMICONDUCTOR MFG12 citations82
US7745904B2Jun 29, 2010

Shallow trench isolation structure for semiconductor device

TAIWAN SEMICONDUCTOR MFG7 citations74
US7547605B2Jun 16, 2009

Microelectronic device and a method for its manufacture

TAIWAN SEMICONDUCTOR MFG5 citations63
US7312136B2Dec 25, 2007

Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance

TAIWAN SEMICONDUCTOR MFG2 citations63
US7202122B2Apr 10, 2007

Cobalt silicidation process for substrates with a silicon—germanium layer

TAIWAN SEMICONDUCTOR MFG6 citations63
US7638376B2Dec 29, 2009

Method for forming SOI device

TAIWAN SEMICONDUCTOR MFG3 citations62
US7602006B2Oct 13, 2009

Semiconductor flash device

TAIWAN SEMICONDUCTOR MFG5 citations60
US7462554B2Dec 9, 2008

Method for forming semiconductor device with modified channel compressive stress

TAIWAN SEMICONDUCTOR MFG3 citations60
US7871742B2Jan 18, 2011

Method for controlling phase angle of a mask by post-treatment

TAIWAN SEMICONDUCTOR MFG0 citations52
US7452805B2Nov 18, 2008

Aluminum based conductor for via fill and interconnect

TAIWAN SEMICONDUCTOR MFG0 citations52
US7444199B2Oct 28, 2008

Method for preparing mask and wafer data files

TAIWAN SEMICONDUCTOR MFG0 citations52

UNITED MICROELECTRONICS CORP

9 patents

TAIWAN SEMICONDUCTOR MFG CO LTD

3 patents

HUANG CHIEN-CHAO

2 patents

TU CHIH-CHIANG

2 patents

LIANG CHUN SHENG

1 patent

Showing the top 50 of 61 patents by PatentIndex Score.