Inventor
LAI MIN-TIH
US8 patents
⚠️ This page may combine multiple inventors who share the name “LAI MIN-TIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS10304799B2May 28, 2019
Land grid array package extension
INTEL CORP4 citations70
US10122836B2Nov 6, 2018
Magnetic convection cooling for handheld device
INTEL CORP2 citations69
US10748873B2Aug 18, 2020
Substrates, assembles, and techniques to enable multi-chip flip chip packages
INTEL CORP3 citations65
US11652031B2May 16, 2023
Shrinkable package assembly
INTEL CORP0 citations61
US10872880B2Dec 22, 2020
Land grid array package extension
INTEL CORP0 citations49
US10573575B2Feb 25, 2020
Semiconductor package with thermal fins
INTEL CORP0 citations49
US10770429B2Sep 8, 2020
Microelectronic device stacks having interior window wirebonding
INTEL CORP0 citations36