Inventor

HSU WEI-YUNG

US50 patents

⚠️ This page may combine multiple inventors who share the name “HSU WEI-YUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU WEI-YUNG

TEXAS INSTRUMENTS INC

Semiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodes

Method to protect metal from oxidation during poly-metal gate formation in semiconductor device manufacturing

Selective oxidation methods for metal oxide deposition on metals in capacitor fabrication

Reduced temperature contact/via filling

Stable and low resistance metal/barrier/silicon stack structure and related process for manufacturing

Method of forming ultra-thin and conformal diffusion barriers encapsulating copper

Method of forming diffusion barriers encapsulating copper

Barrier-less plug structure

Method for non-destructive, non-contact measurement of dielectric constant of thin films

Cavity-filling method for reducing surface topography and roughness

Reduced temperature contact/via filling

Method of forming diffusion barriers for copper metallization in integrated cirucits

Multi-stage semiconductor cavity filling process

TiN+Al films and processes

Method to improve the texture of aluminum metallization

Method of improving texture of metal films in semiconductor integrated circuits

Method for producing barrier-less plug structures

Sloped storage node for a 3-D dram cell structure

Low resistivity poly-silicon gate produced by selective metal growth

Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback process

Method of forming contacts and vias in semiconductor

Selective aluminum plug formation and etchback process

Using a carbon film as an etch hardmask for hard-to-etch materials

Method of improving the texture of aluminum metallization for tungsten etch back processing

Si-rich surface layer capped diffusion barriers

System and method for electroplating fine geometries

Barrier/liner with a SiNx-enriched surface layer on MOCVD prepared films

Methods for chemical vapor deposition of tungsten on silicon or dielectric

Versatile system for chromium based diffusion barriers in electrode structures

Plasma-enhanced chemical vapor deposition of a nucleation layer in a tungsten metallization process

Method for fabricating metal conductors and multi-level interconnects in a semiconductor device

Integration of fluorinated dielectrics in multi-level metallizations

APPLIED MATERIALS INC

Planarization of substrates using electrochemical mechanical polishing

Method for adjusting substrate processing times in a substrate polishing system

Method for dishing reduction and feature passivation in polishing processes

Method and composition for polishing a substrate

Methods and apparatus for processing a substrate

Methods and compositions for chemical mechanical polishing shallow trench isolation substrates

CMP pad thickness and profile monitoring system

Methods and compositions for chemical mechanical polishing

Methods for reducing delamination during chemical mechanical polishing

Grooved retaining ring

Method and apparatus for electro-chemical processing

Polishing pad conditioning process

Extended pad life for ECMP and barrier removal

Method and composition for electrochemical mechanical polishing processing

Methods for reducing delamination during chemical mechanical polishing

Integrated multi-step gap fill and all feature planarization for conductive materials

CHUNG HUA

Cleaning plate for inducing turbulent flow of a processing chamber cleaning glass

Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas