Inventor

OHSAWA SHINJI

JP38 patents

⚠️ This page may combine multiple inventors who share the name “OHSAWA SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OHSAWA SHINJI

TOSHIBA KK

MOS-type solid-state imaging apparatus

High-speed solid-state imaging device capable of suppressing image noise

MOS-type solid-state imaging apparatus

Solid-state imaging device

MOS-type solid-state imaging apparatus

MOS-type solid-state imaging apparatus using a unit cell formed of a photoelectric converter, amplification transistor, address capacitor, and reset transistor

CCD image sensor with stacked charge transfer gate structure

CMOS image sensor having wide dynamic range

Amplification-type CMOS image sensor

MOS-type solid-state imaging apparatus

CMOS imaging device for amplifying and fetching signal charge

Solid-state imaging device with dynamic range control

Solid state image sensor device free of influence on optical black level by signal potential change of optical black pixels

Amplification-type CMOS image sensor of wide dynamic range

High-speed solid-state imaging device capable of suppressing image noise

High-speed solid-state imaging device capable of suppressing image noise

Amplification type image pickup apparatus and method of controlling the amplification type image pickup apparatus

Solid-state image sensing device with storage-diode potential controller

Solid-state CCD imaging device with transfer gap voltage controller

Driving method for solid state imaging device

Amplification-type CMOS image sensor

Solid state image sensor with signal line potential adjustment circuit and method of driving the same

Solid-state camera device and method of driving thereof

Amplification type image pickup apparatus and method of controlling the amplification type image pickup apparatus

TOYO KOHAN CO LTD

Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof

Gas separating unit and method for manufacturing the same

Multilayered metal laminate and process for producing the same

Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them

Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit

Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them

Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof

Multilayer printed wiring board and method of manufacturing the same

Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate

TOKYO SHIBAURA ELECTRIC CO

Image system, solid-state imaging semiconductor integrated circuit device used in the image system, and difference output method used for the image system

EGAWA YOSHITAKA

Amplification-type CMOS image sensor

WATANABE MITSUHIRO

Printed wiring board and method for manufacturing printed wiring board

BRILLNICS JAPAN INC

Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus

AOYAMA SATOSHI

Hydrogen separation membrane with a carrier, fuel cell and hydrogen separation apparatus having same, and method of manufacturing same