Inventor
FUKASAWA HIROYUKI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “FUKASAWA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
11 patentsUS5844782ADec 1, 1998
Printed wiring board and electronic device using same
SONY CORP133 citations97
US7728343B2Jun 1, 2010
Light source apparatus and display apparatus and white resist layer
SONY CORP20 citations92
US6992395B2Jan 31, 2006
Semiconductor device and semiconductor module having external electrodes on an outer periphery
SONY CORP25 citations92
US5973931AOct 26, 1999
Printed wiring board and electronic device using same
SONY CORP27 citations92
US5932030AAug 3, 1999
Flux for soldering using solder preforms
SONY CORP23 citations92
US5214846AJun 1, 1993
Packaging of semiconductor chips
SONY CORP27 citations92
US7878680B2Feb 1, 2011
Light source module, light source apparatus and liquid crystal display
SONY CORP11 citations83
US5650177AJul 22, 1997
Resin molding apparatus
SONY CORP10 citations73
US5289033AFeb 22, 1994
Packaging of semiconductor chips with resin
SONY CORP11 citations73
US5882692AMar 16, 1999
Resin molding apparatus
SONY CORP4 citations62
US5268532ADec 7, 1993
Semiconductor device
SONY CORP0 citations41
FUKASAWA HIROYUKI
4 patentsUS8654810B2Feb 18, 2014
Light-emitting device and method of manufacturing the same
FUKASAWA HIROYUKI9 citations80
US8158997B2Apr 17, 2012
Optical element package and method of manufacturing the same
FUKASAWA HIROYUKI3 citations61
US8962355B2Feb 24, 2015
Optical element package and method of manufacturing the same
FUKASAWA HIROYUKI0 citations50
US8619825B2Dec 31, 2013
Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same
FUKASAWA HIROYUKI0 citations50